# US 11,122,685 B2 · Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

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- Number: US 11,122,685 B2
- Document ID: US11122685B2
- Status: Granted
- Kind: B2
- Application number: 16/480,088
- Filed: 2018-01-19
- Published: 2020-06-18
- Granted: 2021-09-14
- Earliest claimed: 2017-01-26
- Assignees: Mitsubishi Gas Chemical Company, Inc.
- Applicants: Mitsubishi Gas Chemical Company, Inc.
- Inventors: Shota Koga; Kentaro Takano
- Web page: https://patentgrep.com/patent/US11122685B2

## CPC

- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- C08J 5/18: Manufacture of films or sheets
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L 75/14: Polyurethanes having carbon-to-carbon unsaturated bonds
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)

## Abstract

A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).

## Claims

### Claim 1

A resin composition comprising:
(i) a reactant of a cyanate compound (A) and a polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and
a maleimide compound (C),
wherein the maleimide compound (C) comprises at least one selected from a group consisting of 2,2′-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, a maleimide compound (C1) represented by the following formula (1-1), and a maleimide compound (C2) represented by the following formula (1-2),
wherein R5 each independently represents a hydrogen atom or a methyl group, and n1 represents an integer of 1 or more,
wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n is an average value and satisfies 1<n≤5, and
wherein the polybutadiene (B) is an unmodified polybutadiene, and wherein the polybutadiene (B) comprises a 1,2-adduct and a 1,4-adduct at a mass ratio of 1:3 to 3:1.

### Claim 2 (depends on 1)

The resin composition according to claim 1, wherein the cyanate compound (A) comprises at least one cyanate compound (A1) selected from a group consisting of a bisphenol A-based cyanate compound, a bisphenol E-based cyanate compound, a bisphenol F-based cyanate compound, and a novolac-based cyanate compound.

### Claim 3 (depends on 2)

The resin composition according to claim 2, wherein the cyanate compound (A) further comprises a cyanate compound (A2) other than the cyanate compound (A1).

### Claim 4 (depends on 2)

The resin composition according to claim 2, wherein an amount of the polybutadiene (B) is 5 to 30 parts by mass based on 100 parts by mass of the cyanate compound (A1).

### Claim 5 (depends on 1)

The resin composition according to claim 1, wherein the polybutadiene (B) comprises a 1,2-adduct and a 1,4-adduct at a mass ratio of 1:1 to 3:1.

### Claim 6 (depends on 1)

The resin composition according to claim 1, wherein a content of the cyanate compound (A) in the resin composition is 1 to 90 parts by mass based on 100 parts by mass of resin solid components.

### Claim 7 (depends on 1)

The resin composition according to claim 1, wherein the maleimide compound (C) contains at least one selected from a group consisting of bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, a maleimide compound (C1) represented by the following formula (1-1), and a maleimide compound (C2) represented by the following formula (1-2),
wherein R5 each independently represents a hydrogen atom or a methyl group, and n1 represents an integer of 1 or more,
wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n is an average value and satisfies 1<n≤5.

### Claim 8 (depends on 1)

The resin composition according to claim 1, further comprising a filler (D).

### Claim 9 (depends on 8)

The resin composition according to claim 8, wherein a content of the filler (D) in the resin composition is 50 to 1600 parts by mass based on 100 parts by mass of the resin solid components.

### Claim 10 (depends on 1)

The resin composition according to claim 1, further comprising any one or more of a group selected from an epoxy resin, a phenolic resin, an oxetane resin, a benzoxazine compound, and a compound having a polymerizable unsaturated group.

### Claim 11 (depends on 1)

A prepreg comprising:
a base material; and
the resin composition according to claim 1, with which the base material is impregnated or coated.

### Claim 12 (depends on 11)

A metal foil-clad laminate comprising:
at least one or more of the prepregs according to claim 11 laminated; and
a metal foil disposed on one surface or both surfaces of the prepreg.

### Claim 13 (depends on 1)

A resin sheet comprising the resin composition according to claim 1.

### Claim 14 (depends on 1)

A printed wiring board comprising:
an insulating layer; and
a conductor layer formed on a surface of the insulating layer, wherein the insulating layer comprises the resin composition according to claim 1.