# US 11,122,683 B2 · Bare die integration with printed components on flexible substrate without laser cut > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,122,683 B2 - Document ID: US11122683B2 - Status: Granted - Kind: B2 - Application number: 16/190,324 - Filed: 2018-11-14 - Published: 2019-04-25 - Granted: 2021-09-14 - Earliest claimed: 2015-12-10 - Assignees: Palo Alto Research Center Incorporated - Applicants: Palo Alto Research Center Incorporated - Inventors: Tse Nga Ng; Ping Mei; Brent S. Krusor; Gregory L. Whiting; Steven E. Ready; Janos Veres - Web page: https://patentgrep.com/patent/US11122683B2 ## CPC - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/0326: {containing O} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/14: using spraying techniques to apply the conductive material {, e.g. vapour evaporation} - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/0198: {batch processes} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/6523: {for connecting to pads at different heights at the same side of the package substrate, interposer or RDL} - H10W 72/07131: {Means for applying material, e.g. for deposition or forming coatings} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/9413: {on encapsulations} - H10W 74/111: {the semiconductor body being completely enclosed} - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made. ## Claims ### Claim 1 An electronic chip assembly comprising: an electronic circuit component having electronic elements on a first surface; a cured bonding material having a depth sufficient to substantially cover a second surface of the electronic circuit component, wherein the electronic circuit component is held in a secured relationship by the cured bonding material, wherein the cured bonding material consists of more than a single bonding material composition, wherein a bonding material composition closer to the electronic circuit component has a stiffer composition than another bonding material composition farther from the electronic circuit component; an upper surface composed of the first surface of the electronic circuit component and at least a portion of the cured bonding material; and printed conductive traces extending between the cured bonding material and the first surface of the electronic circuit component. ### Claim 2 (depends on 1) The assembly according to claim 1 wherein the first surface of the electronic circuit component and a first surface the cured bonding material are substantially planar with respect to each other. ### Claim 3 (depends on 1) The assembly according to claim 1 wherein at least a portion of the cured bonding material is formed in a ramp configuration on each side of the conductive electronic component. ### Claim 4 (depends on 1) The assembly according to claim 1 wherein the cured bonding material is comprised to be deposited by at least one of ink-jet type printing, aerosol type printing, and extrusion type printing. ### Claim 5 An electronic chip assembly comprising: an electronic circuit component having a first surface and a second surface, wherein the first surface has electronic elements located thereon; a cured bonding material having a depth sufficient to substantially cover the second surface of the electronic circuit component, wherein the electronic circuit component is held in a secured relationship by the cured bonding material, wherein the cured bonding material consists of more than a single bonding material composition, wherein a bonding material composition closer to the electronic circuit component has a stiffer composition than another bonding material composition farther from the electronic circuit component; and an upper surface composed of the first surface of the electronic circuit components and at least a portion of the cured bonding material. ### Claim 6 (depends on 5) The assembly according to claim 5, further including printed conductive traces extending between the cured bonding material and the first surface of the electronic circuit component. ### Claim 7 (depends on 5) The assembly according to claim 5 wherein the first surface of the electronic circuit component and a first surface the cured bonding material are substantially planar with respect to each other. ### Claim 8 (depends on 5) The assembly according to claim 5 wherein at least a portion of the cured bonding material is formed in a ramp configuration on each side of the conductive electronic component. ### Claim 9 (depends on 5) The assembly according to claim 5 wherein the cured bonding material is comprised to be deposited by at least one of ink-jet type printing, aerosol type printing, and extrusion type printing.