# US 11,122,680 B2 · Passive methods of loose die identification

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- Number: US 11,122,680 B2
- Document ID: US11122680B2
- Status: Granted
- Kind: B2
- Application number: 16/356,289
- Filed: 2019-03-18
- Published: 2020-09-24
- Granted: 2021-09-14
- Earliest claimed: 2019-03-18
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Nicolas Pizzuti; Tassbieh Hassan; Nathaniel Rex; Kirk D. Peterson; Eric Marz; Christine Whiteside
- Web page: https://patentgrep.com/patent/US11122680B2

## CPC

- G01R 31/311: of integrated circuits {(G01R31/31728 takes precedence)}
- G06T 7/001: {using an image reference approach}
- H05K 1/0269: {for visual or optical inspection}
- G06T 2207/30148: Semiconductor; IC; Wafer
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Embodiments of the invention are directed to a method and resulting structures for identifying an integrated circuit (IC) chip using optically-unique features. In a non-limiting embodiment of the invention, an imaging device generates an image of the chip. One or more optical features of the chip within the image can be determined and stored in a local or remote database. Metadata associated with the chip can be generated and linked with the one or more optical features of the chip and a unique identifier of the chip in the database.

## Claims

### Claim 1

A method for identifying an integrated circuit (IC) chip, the method comprising:
generating, with an imaging device, an image of the chip;
determining one or more optical features of the chip within the image;
generating a candidate unique optical feature comprising one of the one or more optical features;
in response to determining that a database does not include a previously stored optical feature that matches the candidate unique optical feature, storing the candidate unique optical feature in the database;
determining metadata associated with the chip; and
linking the candidate unique optical feature of the chip with the metadata and a unique identifier of the chip.

### Claim 2 (depends on 1)

The method of claim 1, wherein the imaging device is a camera and the image comprises a high-resolution image of a portion of the chip.

### Claim 3 (depends on 1)

The method of claim 1, wherein the image comprises a top surface, a backside, or an edge of the chip.

### Claim 4 (depends on 1)

The method of claim 1, wherein the one or more optical features comprise a scrape or scratch shape, size, location, or color, a laser groove or dicing channel shape or dimension, a C4 bump location, shape, size, or color, or a surface roughness on a backside of the chip, a top surface of the chip, or an edge of the chip.

### Claim 5 (depends on 1)

The method of claim 1, wherein the metadata comprises a lot identification, a wafer identification, and wafer coordinates of the chip prior to dicing.

### Claim 6 (depends on 5)

The method of claim 5, wherein the metadata further comprises a test result of a second chip having a same lot identification or wafer identification as the chip.

### Claim 7

A system for identifying an integrated circuit (IC) chip, the system comprising:
an imaging device configured to take an image of a portion of the chip;
a memory having computer readable instructions; and
a processor configured to execute the computer readable instructions, the computer readable instructions, when executed by the processor, cause the processor to perform a method comprising:
generating, with the imaging device, the image of the chip;
determining one or more optical features of the chip within the image;
generating a candidate unique optical feature comprising one of the one or more optical features;
in response to determining that a database does not include a previously stored optical feature that matches the candidate unique optical feature, storing the candidate unique optical feature in the database;
determining metadata associated with the chip; and
linking the candidate unique optical feature of the chip with the metadata and a unique identifier of the chip.

### Claim 8 (depends on 7)

The system of claim 7, wherein the imaging device is a camera and the image comprises a high-resolution image of the chip.

### Claim 9 (depends on 7)

The system of claim 7, wherein the image comprises a top surface, a backside, or an edge of the chip.

### Claim 10 (depends on 7)

The system of claim 7, wherein the one or more optical features comprise a scrape or scratch shape, size, location, or color, a laser groove or dicing channel shape or dimension, a C4 bump location, shape, size, or color, or a surface roughness on a backside of the chip, a top surface of the chip, or an edge of the chip.

### Claim 11 (depends on 7)

The system of claim 7, wherein the metadata comprises a lot identification, a wafer identification, and wafer coordinates of the chip prior to dicing.