# US 11,122,679 B2 · Printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,122,679 B2 - Document ID: US11122679B2 - Status: Granted - Kind: B2 - Application number: 16/809,932 - Filed: 2020-03-05 - Published: 2021-07-08 - Granted: 2021-09-14 - Earliest claimed: 2020-01-06 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Hiroki Okada; Hee Jung Jung - Web page: https://patentgrep.com/patent/US11122679B2 ## CPC - H05K 1/0233: {Filters, inductors or a magnetic substance} - H05K 1/0222: {for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence} - H05K 1/05: Insulated {conductive substrates, e.g. insulated} metal substrate - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/0298: {Multilayer circuits} - H05K 1/036: {Multilayers with layers of different types} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/4626: {characterised by the insulating layers or materials (H05K3/4688 takes precedence)} - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/0141: Liquid crystal polymer [LCP] - H05K 2201/0269: Non-uniform distribution or concentration of particles - H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer - H05K 2201/0344: Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer - H05K 2201/0358: Resin coated copper [RCC] - H05K 2201/08: Magnetic details - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A printed circuit board includes an insulating body, a wiring structure at least disposed on the insulating body; and a shielding portion including a conductive via disposed around the wiring structure of the insulating body. The conductive via includes first and second metal layers having different degrees of magnetic permeability. ## Claims ### Claim 1 A printed circuit board, comprising: an insulating body; a wiring structure at least disposed on the insulating body; and a shielding portion including a conductive via disposed around the wiring structure of the insulating body, wherein the conductive via comprises first and second metal layers having different degrees of magnetic permeability. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein the conductive via is a conformal via disposed along a wall surface of a via hole penetrating at least a portion of the insulating body. ### Claim 3 (depends on 1) The printed circuit board of claim 1, wherein the first metal layer is disposed on a wall surface of a via hole, the second metal layer is disposed on the first metal layer, and the second metal layer comprises a metal having magnetic permeability higher than that of the first metal layer. ### Claim 4 (depends on 3) The printed circuit board of claim 3, wherein the first metal layer comprises copper (Cu), and the second metal layer comprises an alloy containing iron (Fe) and nickel (Ni). ### Claim 5 (depends on 1) The printed circuit board of claim 1, wherein the shielding portion comprises a plurality of conductive vias, and the plurality of conductive vias are disposed to be spaced apart from each other around the wiring structure. ### Claim 6 (depends on 5) The printed circuit board of claim 5, wherein the shielding portion further comprises a conductive pattern disposed on one side of the insulating body and connected to each of the plurality of conductive vias. ### Claim 7 (depends on 1) The printed circuit board of claim 1, wherein the shielding portion further comprises a ground pattern connected to the conductive via. ### Claim 8 (depends on 1) The printed circuit board of claim 1, wherein the insulating body comprises a laminate of thermosetting resin layer and thermoplastic resin layer. ### Claim 9 (depends on 8) The printed circuit board of claim 8, wherein the thermoplastic resin layer comprises a liquid crystal polymer (LCP). ### Claim 10 (depends on 8) The printed circuit board of claim 8, wherein the thermoplastic resin layer is thicker than the thermosetting resin layer. ### Claim 11 (depends on 8) The printed circuit board of claim 8, wherein the thermoplastic resin layer has a higher dielectric dissipation factor than the thermosetting resin layer. ### Claim 12 (depends on 1) The printed circuit board of claim 1, wherein the insulating body comprises a laminate including a plurality of thermosetting resin layers and a plurality of thermoplastic resin layers alternately stacked in a thickness direction of the printed circuit board. ### Claim 13 (depends on 12) The printed circuit board of claim 12, wherein the wiring structure comprises a plurality of circuit layers and one or more via layers connecting the plurality of circuit layers in the thickness direction, and in a pair of a thermoplastic resin layer and a thermosetting resin layer among the laminate, which are vertically adjacent: a first circuit layer of the plurality of circuit layers is embedded in the thermosetting resin layer of the pair, a second circuit layer of the plurality of circuit layers protrudes on the thermoplastic resin layer of the pair, and a first via layer of the one or more via layers penetrates the thermosetting resin layer and the thermoplastic resin layer to connect the first and second circuit layers. ### Claim 14 (depends on 1) The printed circuit board of claim 1, wherein the insulating body comprises a first thermoplastic resin layer, a first thermosetting resin layer disposed on the first thermoplastic resin layer, a second thermoplastic resin layer disposed on the first thermosetting resin layer, a second thermosetting resin layer disposed on the second thermoplastic resin layer, and a third thermoplastic resin layer disposed on the second thermosetting resin layer, the wiring structure comprises a first circuit layer disposed on the first thermoplastic resin layer and embedded in the first thermosetting resin layer, a second circuit layer disposed on the second thermoplastic resin layer and embedded in the second thermosetting resin layer, a third circuit layer disposed on the third thermoplastic resin layer, a first via layer penetrating the first thermosetting resin layer and the second thermoplastic resin layer and connecting the first and second circuit layers, and a second via layer penetrating the second thermosetting resin layer and the third thermoplastic resin layer and connecting the second and third circuit layers, and the shielding portion comprises the conductive via penetrating the first to third thermoplastic resin layers and the first and second thermosetting resin layers. ### Claim 15 (depends on 14) The printed circuit board of claim 14, wherein the first via layer and the second via layer are tapered a same direction. ### Claim 16 (depends on 1) The printed circuit board of claim 1, wherein the insulating body comprises a first thermoplastic resin layer, a first thermosetting resin layer disposed on an upper surface of the first thermoplastic resin layer, a second thermosetting resin layer disposed on a lower surface of the first thermoplastic resin layer, a second thermoplastic resin layer disposed on an upper surface of the first thermosetting resin layer, and a third thermoplastic resin layer disposed on a lower surface of the second thermosetting resin layer, the wiring structure comprises a first circuit layer disposed on the upper surface of the first thermoplastic resin layer and embedded in the first thermosetting resin layer, a second circuit layer disposed on the lower surface of the first thermoplastic resin layer and embedded in the second thermosetting resin layer, a third circuit layer disposed on an upper surface of the second thermoplastic resin layer, a fourth circuit layer disposed on a lower surface of the third thermoplastic resin layer, a first via layer penetrating the first thermosetting resin layer and the second thermoplastic resin layer and connecting the first and third circuit layers, and a second via layer penetrating the second thermosetting resin layer and the third thermoplastic resin layer and connecting the second and fourth circuit layers, and the shielding portion comprises the conductive via penetrating the first to third thermoplastic resin layers and the first and second thermosetting resin layers. ### Claim 17 (depends on 16) The printed circuit board of claim 16, wherein the first via layer and the second via layer are tapered in directions opposite to each other. ### Claim 18 (depends on 16) The printed circuit board of claim 16, wherein the first and second circuit layers are electrically insulated from each other.