Integrated fan-out device, 3D-IC system, and method

A system, comprising:

• a system on wafer package;
• a socket;
• and
• an integrated fan-out adapter disposed between and separating the socket and the system on wafer package, the integrated fan-out adapter comprising:
• a first redistribution layer and a second redistribution layer;
• an integrated passive device disposed between the first redistribution layer and the second redistribution layer, the integrated passive device being connected to the first redistribution layer;
• and
• conductive vias connecting the first redistribution layer to the second redistribution layer and connecting the socket to the system on wafer package.

A device, comprising:

• a first metallization layer;
• conductive vias to the first metallization layer;
• an integrated passive device over the first metallization layer;
• a second metallization layer over the conductive vias and over the integrated passive device, the second metallization layer being connected to the conductive vias and the integrated passive device;
• first external contacts adjacent to the second metallization layer;
• and
• second external contacts adjacent to the first metallization layer wherein the first external contacts are bonded to external contacts of a system on wafer package, and wherein the second external contacts are bonded to external contacts of a socket.