US 11,118,249 B1 · Method for tuning thermal expansion properties in an additive manufacturing feedstock material

Abstract

A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF.

Claims11

Dependent claims

A feedstock material for use in an additive manufacturing apparatus, the feedstock material comprising:

a first material, wherein a coefficient of thermal expansion for the first material is positive;
and
a metal organic framework (MOF), wherein the MOF comprises a plurality of nodes and a plurality of linkers, the plurality of nodes coupled to the plurality of linkers, thereby forming a framework;
wherein a ratio of the first material to the MOF by weight ranges from 0.5:0.5 to 0.995:0.005;
wherein the feedstock material is a composite material;
wherein, the coefficient of thermal expansion for the MOF is 10% to 25% lower than the coefficient of thermal expansion for the first material.

3 more elements

Dependencies are inferred from the claim text.

Method for tuning thermal expansion properties in an additive manufacturing feedstock material

Life of this patent

Method for tuning thermal expansion properties in an additive manufacturing feedstock material

Life of this patent

Abstract

Claims11