# US 11,116,115 B1 · High power density power supply

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- Number: US 11,116,115 B1
- Document ID: US11116115B1
- Status: Granted
- Kind: B1
- Application number: 16/875,758
- Filed: 2020-05-15
- Granted: 2021-09-07
- Earliest claimed: 2020-05-15
- Assignees: Chyng Hong Electronic Co., Ltd.
- Applicants: Chyng Hong Electronic Co., Ltd.
- Inventors: Mu-Chun Lin
- Web page: https://patentgrep.com/patent/US11116115B1

## CPC

- H05K 7/14325: {for cabinets or racks}
- H05K 5/03: Covers
- H05K 7/1427: {Housings}
- H05K 7/1492: {having electrical distribution arrangements, e.g. power supply or data communications}
- H05K 7/20909: {Forced ventilation, e.g. on heat dissipaters coupled to components}
- Y02B 70/10: Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

A high power density power supply includes at least one power module and a cooling fan in a casing. A first filter circuit board facing upward is provided below the cooling fan. A second filter circuit board facing downward is provided above the cooling fan. The back of the second filter circuit board is provided with a plurality of buffer pads. An insulating plate is disposed on the buffer pads to completely cover the top of the second filter circuit board. Thereby, the insulating plate provided an insulating effect between an upper cover of the casing and the second filter circuit board to prevent the second filter circuit board from directly contacting the upper cover to form a short circuit, so as to improve the safety of the power supply.

## Claims

### Claim 1

A high power density power supply, comprising a casing, the casing being covered with an upper cover, at least one power module being provided in the casing, a cooling fan being provided in front of the power module, a first filter circuit board being provided below the cooling fan, a second filter circuit board being provided in reverse above the cooling fan so that a back of the second filter circuit board faces up, characterized in that: the high power density power supply further comprises a plurality of buffer pads and an insulating plate; the buffer pads are disposed on the back of the second filter circuit board, respectively; the insulating plate is disposed on the buffer pads, the insulating plate completely covers a top of the second filter circuit board, through the buffer pads, a distance is defined between the insulating plate and the second filter circuit board, wherein an insulating sheet is provided between the insulating plate and the second filter circuit board and located above the cooling fan, the second filter circuit board, the insulating sheet and the insulating plate are locked to the cooling fan by a plurality of bolts.

### Claim 2 (depends on 1)

The high power density power supply as claimed in claim 1, wherein the second filter circuit board and the insulating plate are rectangular, and the buffer pads are adhered to four corners of the second filter circuit board, respectively.

### Claim 3 (depends on 1)

The high power density power supply as claimed in claim 1, wherein the buffer pads are made of bakelite.