# US 11,116,100 B2 · Implementation module for stacked connection between isolated circuit components and the circuit thereof

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- Number: US 11,116,100 B2
- Document ID: US11116100B2
- Status: Granted
- Kind: B2
- Application number: 16/521,317
- Filed: 2019-07-24
- Published: 2019-11-14
- Granted: 2021-09-07
- Earliest claimed: 2016-04-25
- Assignees: Shenzhen Xilong Toy Company Limited
- Applicants: Shenzhen Xilong Toy Company Limited
- Inventors: Yipu Zheng
- Web page: https://patentgrep.com/patent/US11116100B2

## CPC

- H05K 7/005: {arrangements of circuit components without supporting structure}
- H10D 8/00: Diodes (variable-capacitance diodes H10D1/64; gated diodes H10D12/00)
- H10W 20/484: {Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes}
- H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
- H10D 10/00: Bipolar junction transistors [BJT]
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/941: {Dispositions of bond pads}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 80/338: {using EM radiation or electron beams, e.g. using lasers}
- H10W 90/00: Package configurations
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention discloses a modularized circuit for isolated circuit, wherein the isolated circuit includes at least two circuit components connecting in parallel and/or series, the circuit components, according to a circuit connection configuration, weld corresponding pins of the components directly, forming an integrated module in accordance with a desired connection method of the circuit, and saving circuit boards and wires; the circuit components are designed as a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped. Due to constructing a circuit unit by welding connections in a way of building blocks, welding directly between components in a 3D space, comparing to the circuits limited in a circuit board plane as a PCB, it owns a wider design space.

## Claims

### Claim 1

A modularized circuit for isolated circuit, wherein
the isolated circuit includes at least two circuit components connecting in parallel and/or series;
the circuit components, in accordance with a connection configuration of a circuit, weld a plurality of corresponding pins of the circuit components directly, making the circuit components form an integrated module in accordance with a connection method of the circuit, and saving circuit boards and wires;
the circuit components are designed in a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped; and
the circuit components further comprise a triode, and three different bonding pad areas including a base electrode area, a collector area and an emitter area are designed on the triode.

### Claim 2 (depends on 1)

The modularized circuit according to claim 1, wherein, the circuit components include a resistor, a capacitor and/or an inductor, and bonding pads are arranged on at least two end faces of the resister/the capacitor/the inductor.

### Claim 3 (depends on 1)

The modularized circuit according to claim 1, wherein the circuit components include a diode, and two bonding pads are arranged on a surface of the diode being able to distinguish different electric current directions.