# US 11,116,096 B2 · Medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,116,096 B2 - Document ID: US11116096B2 - Status: Granted - Kind: B2 - Application number: 16/387,759 - Filed: 2019-04-18 - Published: 2020-10-22 - Granted: 2021-09-07 - Earliest claimed: 2019-04-18 - Assignees: City University of Hong Kong - Applicants: City University of Hong Kong - Inventors: Xinrui Niu; Bo Xu - Web page: https://patentgrep.com/patent/US11116096B2 ## CPC - G06F 30/23: using finite element methods [FEM] or finite difference methods [FDM] - G06F 30/20: Design optimisation, verification or simulation (optimisation, verification or simulation of circuit designs G06F30/30) - G06F 30/30: Circuit design - H04M 1/0266: {for a display module assembly} - H05K 5/03: Covers - C09K 2323/05: Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer - G06F 2119/14: Force analysis or force optimisation, e.g. static or dynamic forces - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE ## Abstract A medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium. The medium including: a first layer of material defining a first portion arranged to connect with a first electronic component of the assembly; and a second layer of material defining a second portion having a set of mechanical properties with one or more values different from those in the first portion, and the second layer of material is arranged to connect with a second electronic component of the assembly; wherein the combination of the first layer of material and the second layer of material is arranged to minimize stress established in the first electronic component when the first electronic component combines with the second electronic component. ## Claims ### Claim 1 A medium for binding components in an assembly of an electronic device, comprising: a first layer of material defining a first portion having mechanical properties and arranged to connect with a first component of the assembly; and a second layer of material, being disposed directly adjacent to the first layer of material, defining a second portion having a set of mechanical properties with one or more values different from those in the first portion, and the second layer of material is arranged to connect with a second component of the assembly; wherein both the first layer of material and the second layer of material comprises a polymeric composite containing a polymer matrix, and at least one of the first layer of material and the second layer of material further comprises ceramic fillers, and the first layer of material and the second layer of material include different contents of ceramic fillers; wherein a combination of the first layer of material and the second layer of material is arranged to minimize stress established in the first component when the first component combines with the second component; wherein each of the first layer of material and the second layer of material includes 0.1-10% of volume percentage of ceramic fillers. ### Claim 2 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the medium is arranged to act as a stress-dispersing layer between the first component and the second component. ### Claim 3 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the medium is arranged to inhibit and deviate the growth of cracks in the first component and in the medium. ### Claim 4 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the value of an individual mechanical property of the mechanical properties of the first portion is different from the value of that same mechanical property of the second portion. ### Claim 5 (depends on 4) The medium for binding components in an assembly of an electronic device according to claim 4, wherein, due to the different values of the individual mechanical property in the first layer of material and the second layer of material, there is a gradual change of the individual mechanical property along the thickness of the medium for binding components. ### Claim 6 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the mechanical property is selected from at least one of Young's modules, hardness, and mechanical strength. ### Claim 7 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the polymeric composite includes a liquid optical clear adhesive material. ### Claim 8 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the ceramic fillers include at least one inorganic compound. ### Claim 9 (depends on 8) The medium for binding components in an assembly of an electronic device according to claim 8, wherein the inorganic compound includes silica and/or zirconia. ### Claim 10 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the first layer of material and the second layer of material are optically transparent. ### Claim 11 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the first layer of material and the second layer of material have the same thickness. ### Claim 12 (depends on 11) The medium for binding components in an assembly of an electronic device according to claim 11, wherein a thickness of the combination of the first and the second layers of material is 0.2 mm. ### Claim 13 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the assembly is a display assembly. ### Claim 14 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the electronic device includes a computing device and/or a display device. ### Claim 15 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the first component and the second component include at least two of a transparent cover, a touch panel and a display panel. ### Claim 16 (depends on 1) The medium for binding components in an assembly of an electronic device according to claim 1, wherein the first component includes a piece of glass. ### Claim 17 (depends on 1) A display assembly of an electronic device, comprising a first component and a second component, and a medium for binding components in an assembly in accordance with claim 1.