# US 11,116,083 B2 · Electronic component embedded by laminate sheet > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,116,083 B2 - Document ID: US11116083B2 - Status: Granted - Kind: B2 - Application number: 16/088,993 - Filed: 2017-03-28 - Published: 2019-08-15 - Granted: 2021-09-07 - Earliest claimed: 2016-03-31 - Assignees: AT&S (China) Co. Ltd. - Applicants: AT&S (China) Co. Ltd. - Inventors: Annie Tay; Mikael Tuominen - Web page: https://patentgrep.com/patent/US11116083B2 ## CPC - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/4655: {by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K1/03, H05K3/4673)} - H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)} - H05K 2201/0358: Resin coated copper [RCC] - H05K 2201/09136: Means for correcting warpage - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/0198: {batch processes} - H10W 72/9413: {on encapsulations} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet. ## Claims ### Claim 1 A component carrier, comprising: a core having a recess; an electronic component arranged in the recess, wherein a vertical thickness of the electronic component is larger than a vertical thickness of the core; a laminated electrically insulating sheet covering at least part of a top main surface of the core, the laminated electrically insulating sheet with a through hole or indentation at the position of the electronic component, the laminated insulating sheet having a thickness approximately equal to a difference of the vertical thickness of the electronic component and the vertical thickness of the core, the laminated electrically insulating sheet filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess; and an electrically insulating layer structure formed on top of the laminated electrically insulating sheet, so that the electrically insulating layer structure covers the electronic component; wherein an electrically conductive layer structure formed on the electrically insulating layer structure covers vertical walls of the core defining the recess, the electronic component and the recess; and wherein a build-up on an upper main surface of the laminated electrically insulating sheet is substantially symmetrical to another build-up on a lower main surface of the core, the electronic component and the laminated electrically insulating sheet. ### Claim 2 A component carrier, comprising: a core having a recess; an electronic component arranged in the recess wherein a bottom main surface of the electronic component is flush with a bottom main surface of the core, wherein a vertical thickness of the electronic component is larger than a vertical thickness of the core; a laminated electrically insulating sheet covering at least part of a top main surface of the core, the laminated electrically insulating sheet with a through hole or indentation at the position of the electronic component, the laminated electrically insulating sheet having a thickness approximately equal to a difference of the vertical thickness of the electronic component and the vertical thickness of the core and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess; and an electrically insulating layer structure formed on top of the laminated electrically insulating sheet, so that the electrically insulating layer structure covers the electronic component; wherein an electrically conductive layer structure formed on the electrically insulating layer structure covers the electronic component and the recess; wherein the laminated electrically insulating sheet covers the upper surface of the electronic component; and wherein a build-up on an upper main surface of the laminated electrically insulating sheet is substantially symmetrical to another build-up on a lower main surface of the core, the electronic component and the laminated electrically insulating sheet; wherein the component carrier comprises at least one first via that reaches at least partially through the laminated electrically insulating sheet to contact at least partially the upper surface of the electronic component, a further electrically insulating layer structure laminated on a bottom of the core and on a bottom of the electronic component; wherein the component carrier comprises at least one second via that reaches at least partially through the further electrically insulating layer structure to contact at least partially the bottom surface of the electronic component. ### Claim 3 (depends on 1) The component carrier according to claim 1, wherein a bottom main surface of the electronic component is flush with a bottom main surface of the core. ### Claim 4 (depends on 1) The component carrier according to claim 1, wherein the electronic component is contacted on opposed surfaces by the same material. ### Claim 5 (depends on 1) The component carrier according to claim 1, wherein the another build-up on a lower main surface of the core includes a further electrically insulating layer structure laminated on a bottom of the core and on a bottom of the electronic component. ### Claim 6 (depends on 5) The component carrier according to claim 5, wherein the electrically insulating layer structure and the further electrically insulating layer structure are made of the same material. ### Claim 7 (depends on 5) The component carrier according to claim 5, wherein the laminated electrically insulating sheet, the electrically insulating layer structure and the further electrically insulating layer structure have substantially the same coefficient of thermal expansion. ### Claim 8 (depends on 5) The component carrier according to claim 5, wherein the laminated electrically insulating sheet, the electrically insulating layer structure and the further electrically insulating layer structure have a coefficient of thermal expansion of less than 20 ppm/° C. ### Claim 9 (depends on 1) The component carrier according to claim 1, wherein the laminated electrically insulating sheet is an adhesive sheet comprising one of the group consisting of resin, prepreg and Resin Coated Copper. ### Claim 10 (depends on 2) The component carrier according to claim 2, wherein the electrically insulating layer structure comprises at least part of at least one of prepreg and Resin Coated Copper. ### Claim 11 (depends on 1) The component carrier according to claim 1, comprising at least one of the following features: the core comprises at least one electrically conductive vertical through connection made of copper; the core comprises a fully cured dielectric; the recess is free of additional adhesive material. ### Claim 12 (depends on 1) The component carrier according to claim 1, further comprising: adhesive material in the recess between at least part of the electronic component and the core. ### Claim 13 (depends on 1) The component carrier according to claim 1, wherein a vertical center of the electronic component is located vertically asymmetrically with regard to a vertical center of the core and the electrically insulating sheet. ### Claim 14 (depends on 1) The component carrier according to claim 1, comprising at least one of the following features: at least one electrically conductive layer structure is laminated on and/or within the component carrier, wherein the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, and nickel; at least one of the laminated electrically insulating sheet the electrically insulating layer structure comprises at least one of the group consisting of resin, Bismaleimide-Triazine resin, cyanate ester, glass, glass fibers, prepreg material, polyimide, polyamide, polytetrafluoroethylene, liquid crystal polymer, epoxy-based Build-Up Film, FR4 material, FR5 material, a ceramic, and a metal oxide; the component carrier is shaped as a plate; the component carrier is configured as one of the group consisting of a printed circuit board, and a substrate; the electronic component is selected from a group consisting of an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a magnetic element and a logic chip; is configured as a laminate-type component carrier. ### Claim 15 A method of manufacturing a component carrier, the method comprising: providing a core having a recess; arranging an electronic component in the recess, wherein a vertical thickness of the electronic component is larger than a vertical thickness of the core; laminating an electrically insulating sheet with the core and the electronic component so that material of the electrically insulating sheet covers at least part of the core and fills a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, wherein the electrically insulating sheet is provided as a recessed layer having a recess to accommodate an upper portion of the electronic component, the electrically insulating sheet having a thickness approximately equal to a difference of the vertical thickness of the electronic component and the vertical thickness of the core; laminating a further electrically insulating layer structure on top of the electrically insulating sheet, so that the further electrically insulating layer structure covers the electronic component; and laminating an electrically conductive layer structure on the electrically insulating layer structure, the electrically conductive layer structure covering the electronic component and extending beyond the recess; wherein a build-up on an upper main surface of the laminated electrically insulating sheet is substantially symmetrical to another build-up on a lower main surface of the core, the electronic component and the laminated electrically insulating sheet. ### Claim 16 (depends on 15) The method according to claim 15, further comprising at least one of the following features: the electronic component is arranged in the recess so that a bottom main surface of the electronic component is aligned with a bottom main surface of the core; the method further comprises laminating an adhesive tape to the core before arranging the electronic component in the core and adhering the electronic component to the adhesive tape, wherein the method further comprises removing the adhesive tape after laminating the electrically insulating sheet; before laminating the electrically insulating sheet, the electrically insulating sheet comprises at least partially uncured material which is cured during laminating the electrically insulating sheet. ### Claim 17 (depends on 1) The component carrier according to claim 1, wherein the component carrier comprises at least one via that reaches through the electrically insulating layer structure and at least partially through the laminated electrically insulating sheet. ### Claim 18 (depends on 15) The method according to claim 15, further comprising: forming at least one via that reaches through the electrically insulating layer structure and at least partially through the laminated electrically insulating sheet.