# US 11,116,078 B2 · Prepregs and laminates having homogeneous dielectric properties > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,116,078 B2 - Document ID: US11116078B2 - Status: Granted - Kind: B2 - Application number: 16/808,068 - Filed: 2020-03-03 - Published: 2020-10-01 - Granted: 2021-09-07 - Earliest claimed: 2013-02-06 - Applicants: Isola USA Corp. - Inventors: Tarun Amla; Johann R. Schumacher; Sascha Kreuer; Peggy Conn; Stanley E. Wilson - Web page: https://patentgrep.com/patent/US11116078B2 ## CPC - H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)} - C08J 5/244: {using glass fibres} - C08J 5/249: {characterised by the additives used in the prepolymer mixture} - H01B 3/40: epoxy resins - C08J 2300/22: Thermoplastic resins - C08J 2300/24: Thermosetting resins - H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line} - H05K 1/0248: {Skew reduction or using delay lines} - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] - Y10T 428/2481: including layer of mechanically interengaged strands, strand-portions or strand-like strips - Y10T 428/24893: including particulate material - Y10T 428/24917: including metal layer - Y10T 428/24926: including ceramic, glass, porcelain or quartz layer - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%. ## Claims ### Claim 1 A prepreg comprising: an at least partially cured resin impregnated reinforcing material portion having a dielectric constant DkWR, comprising reinforcing material and a resin, where the reinforcing material has a dielectric constant DkR prior to the resin impregnation; and a free resin portion having a dielectric constant DkW, wherein the resin includes at least one high dielectric constant material, which is incorporated into the resin in an amount sufficient to match the DkWR with the DkW such that the DkWR and DkW differ by no more than (±) 15%, and wherein the dielectric constant DkW and the dielectric constant DkR differ by more than 15%. ### Claim 2 (depends on 1) The prepreg of claim 1 wherein the one or more high dielectric constant materials each have a Dk of at least 500. ### Claim 3 (depends on 1) The prepreg of claim 1 wherein the one or more high dielectric constant materials are particulate materials. ### Claim 4 (depends on 3) The prepreg of claim 3 wherein the one or more high dielectric constant material particle size ranges from about 1 nm to about 40 microns. ### Claim 5 (depends on 1) The prepreg of claim 1 wherein the one or more high dielectric constant materials are ferroelectric materials. ### Claim 6 (depends on 5) The prepreg of claim 5 wherein the ferroelectric materials are selected from the group consisting of strontium titanate, barium titanate, lead titanate, lead zirconate titanate, lead lanthanum zirconate titanate and combinations thereof. ### Claim 7 (depends on 1) The prepreg of claim 1 wherein the base resin is a thermoset or thermoplastic resin. ### Claim 8 (depends on 1) The prepreg of claim 1 wherein one or more high dielectric constant materials are present in the composition in an amount ranging from about 2 to about 70 wt %. ### Claim 9 (depends on 1) The prepreg of claim 1 wherein the reinforcing material is selected from the group consisting of woven glass fabric, paper, felt, glass fibers, and plastic sheets. ### Claim 10 (depends on 9) The prepreg of claim 9 wherein the reinforcing material is a low Dk woven glass fabric. ### Claim 11 (depends on 10) The prepreg of claim 10 wherein the low Dk woven glass fabric has a Dk ranging from about 3.5 to about 7.0. ### Claim 12 (depends on 1) The prepreg of claim 1 wherein the free resin is any resin that is at least 1 micron from any reinforcement surface. ### Claim 13 (depends on 1) The prepreg of claim 1 wherein the resin composition comprises at least one base resin and from about 5 to about 60 wt % of particles of the one or more high dielectric constant materials selected from the group consisting of strontium titanate, barium titanate, lead titanate, lead zirconate titanate, lead lanthanum zirconate titanate and combinations. ### Claim 14 (depends on 1) The prepreg of claim 1 wherein the DkWR and DkW differ by no more than (±) 5%. ### Claim 15 (depends on 1) The prepreg of claim 1 wherein the DkR and the dielectric constant of the resin without the high dielectric constant material differ by more than 30%. ### Claim 16 (depends on 1) A laminate including a fully cured prepreg of claim 1. ### Claim 17 (depends on 16) The laminate of claim 16 including at least one copper layer. ### Claim 18 (depends on 1) A printed circuit board including as at least one layer, a fully cured prepreg of claim 1. ### Claim 19 (depends on 1) The prepreg of claim 1 wherein the free resin portion comprises any portion of the resin that is a distance of at least 1 micron from any top, bottom, or side surface of the reinforcing material. ### Claim 20 A prepreg comprising: a reinforcing material having a DkR, and a resin composition comprising one or more base resins having a dielectric constant DkW, where DkR is more than 15% greater than DkW, the resin composition further comprising one or more high dielectric constant materials in an amount sufficient to impart the resin composition with a cured dielectric constant DkWR that matches the DkR to which the resin composition is applied to within (±) 15%.