# US 11,116,077 B2 · Wiring board, electronic device, and electronic module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,116,077 B2 - Document ID: US11116077B2 - Status: Granted - Kind: B2 - Application number: 16/963,856 - Filed: 2019-01-23 - Published: 2021-02-11 - Granted: 2021-09-07 - Earliest claimed: 2018-01-24 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Takuo Kisaki; Keisuke Sawada - Web page: https://patentgrep.com/patent/US11116077B2 ## CPC - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - H10W 70/685: comprising multiple insulating layers - H03B 5/32: being a piezoelectric resonator (selection of piezoelectric material H10N30/00) - H03H 9/02: Details - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H10W 70/6525: {for securing the interconnections to the substrate, e.g. to prevent peeling} - H10W 76/12: characterised by their shape - H10W 76/153: having interconnections in passages through the insulating or insulated base - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/09281: Layout details of a single conductor - H05K 2201/10083: Electromechanical or electro-acoustic component, e.g. microphone - H05K 2201/10378: Interposers - H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers} - H10W 70/68: Shapes or dispositions thereof - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H03B: GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS (generators adapted for electrophonic musical instruments G10H; masers or lasers H01S; generation of oscillations in plasma H05H) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract A wiring board comprising an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, wherein the penetrating portion penetrates into the external connection conductor. ## Claims ### Claim 1 A wiring board comprising: an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, the entire external connection conductor embedded within the insulation substrate, wherein the penetrating portion is embedded within the insulation substrate and penetrates into the external connection conductor. ### Claim 2 (depends on 1) The wiring board according to claim 1, wherein a tip end of the penetrating portion forms an acute angle in a section perpendicular to the main surface. ### Claim 3 (depends on 2) The wiring board according to claim 2, wherein the external connection conductor further comprises a sheet-shaped conductor that is positioned at the main surface and a branch conductor that branches off toward an inner side of the insulation substrate from a portion of the sheet-shaped conductor, and further wherein the penetrating portion is interposed between the sheet-shaped conductor and the branch conductor. ### Claim 4 (depends on 3) The wiring board according to claim 3, wherein the sheet-shaped conductor has a quadrilateral shape, and the penetrating portion is positioned in an entire region of a side of the sheet-shaped conductor when viewed in a direction perpendicular to the main surface. ### Claim 5 (depends on 4) An electronic device comprising: the wiring board according to claim 4; and an electronic component mounted on the wiring board. ### Claim 6 (depends on 5) An electronic module comprising: the electronic device according to claim 5; and a module substrate on which the electronic device is mounted. ### Claim 7 (depends on 3) An electronic device comprising: the wiring board according to claim 3; and an electronic component mounted on the wiring board. ### Claim 8 (depends on 7) An electronic module comprising: the electronic device according to claim 7; and a module substrate on which the electronic device is mounted. ### Claim 9 (depends on 2) An electronic device comprising: the wiring board according to claim 2; and an electronic component mounted on the wiring board. ### Claim 10 (depends on 9) An electronic module comprising: the electronic device according to claim 9; and a module substrate on which the electronic device is mounted. ### Claim 11 (depends on 1) The wiring board according to claim 1, wherein the external connection conductor further comprises a sheet-shaped conductor that is positioned at the main surface and a branch conductor that branches off toward an inner side of the insulation substrate from a portion of the sheet-shaped conductor, and further wherein the penetrating portion is interposed between the sheet-shaped conductor and the branch conductor. ### Claim 12 (depends on 11) An electronic device comprising: the wiring board according to claim 11; and an electronic component mounted on the wiring board. ### Claim 13 (depends on 12) An electronic module comprising: the electronic device according to claim 12; and a module substrate on which the electronic device is mounted. ### Claim 14 (depends on 11) The wiring board according to claim 11, wherein the sheet-shaped conductor has a quadrilateral shape, and the penetrating portion is positioned in an entire region of a side of the sheet-shaped conductor when viewed in a direction perpendicular to the main surface. ### Claim 15 (depends on 14) An electronic device comprising: the wiring board according to claim 14; and an electronic component mounted on the wiring board. ### Claim 16 (depends on 15) An electronic module comprising: the electronic device according to claim 15; and a module substrate on which the electronic device is mounted. ### Claim 17 (depends on 1) An electronic device comprising: the wiring board according to claim 1; and an electronic component mounted on the wiring board. ### Claim 18 (depends on 17) An electronic module comprising: the electronic device according to claim 17; and a module substrate on which the electronic device is mounted. ### Claim 19 (depends on 1) The wiring board according to claim 1, wherein the exposed portion of the external connection conductor is positioned at a same plane as the main surface of the insulation substrate. ### Claim 20 (depends on 1) The wiring board according to claim 1, wherein the penetrating portion is positioned at a same plane as the main surface of the insulation substrate.