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US 11,116,075 B2Granted
Component carrier comprising dielectric structures with different physical properties
AssigneeAT&S (China) Co. Ltd.
InventorsKim Liu, Nick Xin, Howard Li, Henry Guo
Life of this patent
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Abstract
A component carrier with a stack having at least one electrically conductive layer structure and a plurality of electrically insulating layer structures and a component embedded in the stack. The plurality of electrically insulating layer structures include a first dielectric structure and a second dielectric structure differing concerning at least one physical property.
Claims17
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures;
- a component embedded in the stack, wherein the component is embedded in an encapsulant which is one of the plurality of electrically insulating layer structures;
- wherein the plurality of electrically insulating layer structures further comprises a first dielectric structure and a second dielectric structure differing from each other concerning at least one physical property,
- wherein the component is sandwiched between the first and second dielectric structures;
- wherein the first and second dielectric structures partially or entirely surround the component without contact;
- wherein the first and second dielectric structures directly contact the encapsulant;
- wherein at least one opening in the stack that is configured to suppress warpage of the component carrier and filled by a filling material;
- wherein the filling material is different to a material of the encapsulant in terms of a coefficient of thermal expansion and/or a Young modulus so that the opening makes the stack more yieldable or flexible during thermal expansion to thereby suppress warpage of the component carrier.
5 more elements
An assembly, comprising:
- a component carrier including a stack with at least one electrically conductive layer structure and a plurality of electrically insulating layer structures including a first dielectric structure and a second dielectric structure differing from one another in at least one physical property, the component carrier further including a component embedded in an encapsulant where the encapsulant is in direct contact with the first dielectric structure and the second dielectric structure;
- wherein at least one opening in the stack is filled by a filling material;
- wherein the filling material is different to a material of the encapsulant in terms of a coefficient of thermal expansion and/or a Young modulus;
- and
- a further component carrier, wherein the component carrier with the component is embedded in the further component carrier having different physical properties;
- wherein the component carrier and the further component carrier both are printed circuit boards so that the assembly forms a board-in-board configuration.
3 more elements
A method of manufacturing a component carrier, comprising:
- forming a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures, wherein the plurality of electrically insulating layer structures comprises an encapsulant, a first dielectric structure and a second dielectric structure, the first and the second dielectric structures differing from each other concerning at least one physical property;
- and
- embedding a component in the stack such that the component is embedded in the encapsulant;
- wherein the first and second dielectric structures partially or entirely surround the component without contact;
- wherein the first and second dielectric structures directly contact the encapsulant;
- forming at least one opening in the stack;
- filling a filling material in the at least one opening in a further process step;
- wherein the filling material is different to a material of the encapsulant in terms of a coefficient of thermal expansion and/or a Young modulus so that the opening makes the stack more yieldable or flexible during thermal expansion to thereby suppress warpage of the component carrier.
5 more elements
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures;
- a component embedded in an encapsulant in the stack;
- wherein the plurality of electrically insulating layer structures further comprises a first dielectric structure and a second dielectric structure differing from each other concerning at least one physical property;
- and
- at least one opening provided in the stack and filled by a filling material, wherein the filling material is different to a material of the encapsulant in terms of a coefficient of thermal expansion and/or a Young modulus so that the component carrier is yieldable or flexible during thermal expansion to thereby suppress warpage of the component carrier.
2 more elements
Dependencies are inferred from the claim text.