# US 11,116,074 B2 · Colored thin covering film and manufacturing method

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- Number: US 11,116,074 B2
- Document ID: US11116074B2
- Status: Granted
- Kind: B2
- Application number: 15/841,448
- Filed: 2017-12-14
- Published: 2018-08-30
- Granted: 2021-09-07
- Earliest claimed: 2017-02-24
- Assignees: Asia Electronic Material Co., Ltd.
- Applicants: Asia Electronic Material Co., Ltd.
- Inventors: Wei-Chih Lee; Li-Chih Yang; Chien-Hui Lee
- Web page: https://patentgrep.com/patent/US11116074B2

## CPC

- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line}
- B32B 27/36: comprising polyesters
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 2250/02: 2 layers
- B32B 2250/24: All layers being polymeric
- B32B 2250/242: All polymers belonging to those covered by group B32B27/32
- B32B 2250/244: All polymers belonging to those covered by group B32B27/36
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/20: Inorganic coating
- B32B 2255/26: Polymeric coating
- B32B 2255/28: Multiple coating on one surface
- B32B 2307/204: Di-electric
- B32B 2307/302: Conductive
- B32B 2307/4023: on the layer surface, e.g. ink
- B32B 2307/518: bi-axially
- B32B 2457/08: PCBs, i.e. printed circuit boards
- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- H05K 2201/012: Flame-retardant; Preventing of inflammation
- H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
- H05K 2201/015: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H05K 2201/0154: Polyimide
- H05K 2201/0175: Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
- H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H05K 2201/0761: Insulation resistance, e.g. of the surface of the PCB between the conductors
- H05K 2203/066: Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
- H05K 2203/161: Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 μm, and the thickness of the low dielectric glue layer is between 3 to 25 μm, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 μm. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.

## Claims

### Claim 1

A colored thin covering film, comprising:
an upper detached layer;
a colored ink layer formed on the upper detached layer and having a thickness of from 1 μm to 10 μm;
a low dielectric glue layer formed on the colored ink layer to sandwich the colored ink layer between the upper detached layer and the low dielectric glue layer, the low dielectric glue layer having a thickness of from 3 μm to 25 μm for a total thickness between the colored ink layer and the low dielectric glue layer to be from 4 μm to 35 μm; and
a lower detached layer formed on the low dielectric glue layer to sandwich the low dielectric glue layer between the colored ink layer and the lower detached layer,
wherein the low dielectric glue layer comprises sintered silicon dioxide, polytetrafluoroethylene, a fluorine-based resin excluded from polytetrafluoroethylene, a phosphorus-based flame retardant, and a polyimide resin, with a total content of the sintered silicon dioxide, the polytetrafluoroethylene, the fluorine-based resin excluded from polytetrafluoroethylene, and the phosphorus-based flame retardant to be from 8 wt % to 50 wt % of a total solid content of the low dielectric glue layer, and the polyimide resin has a content from 40 wt % to 90 wt % of the total solid content of the low dielectric glue layer,
wherein the sintered silicon dioxide has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer, the polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, the fluorine-based resin excluded from polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, and the phosphorus-based flame retardant has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer.

### Claim 2 (depends on 1)

The colored thin covering film of claim 1, wherein the low dielectric glue layer has a Dk value of from 2.4 to 2.8 at 10 GHz, and a Df value of from 0.002 to 0.006 at 10 GHz.

### Claim 3 (depends on 1)

The colored thin covering film of claim 1, wherein the low dielectric glue layer has a water absorption rate of from 0.05% to 0.2%.

### Claim 4 (depends on 1)

The colored thin covering film of claim 1, wherein the low dielectric glue layer has an insulation resistance between wires greater than 1011Ω, a surface resistance greater than 1012Ω, and a volume resistance greater than 1013 Ω·cm.

### Claim 5 (depends on 1)

The colored thin covering film of claim 1, wherein the colored ink layer is composed of at least one resin selected from the group consisting of an epoxy resin, an acrylic resin, an urethane resin, a silicon rubber resin, a poly-p-xylene resin, a bismaleimide-based resin, a polyimide resin, a polyamideimide resin, and a polyamide resin.

### Claim 6 (depends on 1)

The colored thin covering film of claim 1, wherein at least one of the upper detached layer and the lower detached layer is composed of at least one polymer independently selected from the group consisting of polypropylene, biaxially oriented polypropylene, and polyethylene terephthalate.

### Claim 7 (depends on 1)

The colored thin covering film of claim 1, wherein the colored ink layer comprises at least one of an inorganic pigment and an organic pigment.

### Claim 8 (depends on 7)

The colored thin covering film of claim 7, wherein the inorganic pigment is cadmium red, cadmium lemon yellow, cadmium yellow orange, titanium dioxide, carbon black, black iron oxide, or black complex inorganic pigment.

### Claim 9 (depends on 7)

The colored thin covering film of claim 7, wherein the organic pigment is aniline black, perylene black, anthraquinone black, benzidine-based yellow pigment, phthalocyanine blue, or phthalocyanine green.

### Claim 10 (depends on 1)

The colored thin covering film of claim 1, wherein the colored ink layer has a thickness of from 3 μm to 5 μm.

### Claim 11 (depends on 1)

The colored thin covering film of claim 1, wherein the low dielectric glue layer has a thickness of from 3 μm to 10 μm.

### Claim 12 (depends on 1)

A method for preparing the colored thin covering film of claim 1, comprising:
coating a colored ink raw material on a lower surface of the upper detached layer;
curing the colored ink raw material at a temperature of from 50° C. to 180° C. to form the colored ink layer;
forming the low dielectric glue layer on a lower surface of the colored ink layer with a coating process or a transfer printing process; and
adhering the lower detached layer on a lower surface of the low dielectric glue layer.