# US 11,116,046 B2 · Heater

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- Number: US 11,116,046 B2
- Document ID: US11116046B2
- Status: Granted
- Kind: B2
- Application number: 15/775,156
- Filed: 2016-09-29
- Published: 2018-11-15
- Granted: 2021-09-07
- Earliest claimed: 2015-11-12
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Kazuhiro Kuchimachi
- Web page: https://patentgrep.com/patent/US11116046B2

## CPC

- H05B 3/283: {the insulating material being an inorganic material, e.g. ceramic}
- H05B 3/265: {the insulating base being an inorganic material, e.g. ceramic (H05B3/262 takes precedence)}
- H05B 3/74: Non-metallic plates {, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits}
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H05B 2203/003: using serpentine layout
- H05B 2203/013: Heaters using resistive films or coatings
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A heater includes a first ceramic substrate having a heating face on one main face thereof; a second ceramic substrate disposed so that one main face thereof covers the other main face of the first ceramic substrate; a heat generating resistor disposed on the one main face of the second ceramic substrate; and an adhesive layer which bonds the first ceramic substrate and the second ceramic substrate while covering the heat generating resistor.

## Claims

### Claim 1

A heater, comprising:
a first ceramic substrate having a heating face on a first main face thereof;
a second ceramic substrate disposed so that a first main face of the second ceramic substrate covers a second main face of the first ceramic substrate;
a heat generating resistor disposed on the first main face of the second ceramic substrate; and
an adhesive layer which bonds the first ceramic substrate and the second ceramic substrate while covering the heat generating resistor
wherein the first main face of the second ceramic substrate includes a groove section, and the heat generating resistor is disposed on a bottom face of the groove section along a profile of the groove section,
wherein a thickness of the heat generating resistor is smaller than a depth of the groove section,
wherein the thickness of the heat generating resistor becomes gradually smaller toward a center side in a width direction of the groove section, and
wherein the second ceramic substrate is 1 to 10 mm in thickness.

### Claim 2 (depends on 1)

The heater according to claim 1, wherein a clearance is provided between the heat generating resistor and the adhesive layer.

### Claim 3 (depends on 1)

The heater according to claim 1, further comprising a temperature sensor inside the first ceramic substrate.