# US 11,115,745 B2 · Systems and methods for antenna and ground plane mounting schemes for in-ear headphone > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,115,745 B2 - Document ID: US11115745B2 - Status: Granted - Kind: B2 - Application number: 16/239,940 - Filed: 2019-01-04 - Published: 2020-07-09 - Granted: 2021-09-07 - Earliest claimed: 2019-01-04 - Assignees: Bose Corporation - Applicants: Bose Corporation - Inventors: Richard Arthur Grebe; David Partridge - Web page: https://patentgrep.com/patent/US11115745B2 ## CPC - H01Q 1/273: {Adaptation for carrying or wearing by persons or animals} - H04R 1/1025: Accumulators specially adapted for earpieces; Arrangements specially adapted for charging thereof - H01M 50/109: of button or coin shape - H01M 50/216: adapted for button or coin cells - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/40: Radiating elements coated with or embedded in protective material - H04R 1/02: Casings; Cabinets {; Supports therefor;} Mountings therein (H04R1/28 takes precedence {; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075}) - H04R 1/1016: {Earpieces of the intra-aural type} - Y02E 60/10: Energy storage using batteries - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract Systems and methods are directed to a wireless headphone comprising a wireless headphone cap comprising an antenna, and a printed circuit board configured to be directly mechanically connected to the wireless headphone cap at a fixed distance from the wireless headphone cap, and electrically connected to the antenna. ## Claims ### Claim 1 A wireless headphone comprising: a wireless headphone cap comprising an antenna embedded in the wireless headphone cap; and a printed circuit board (PCB) configured to be: directly mechanically connected to the wireless headphone cap at a fixed distance from the wireless headphone cap; and electrically connected to the antenna. ### Claim 2 (depends on 1) The wireless headphone of claim 1, wherein the antenna is formed using laser direct structuring. ### Claim 3 (depends on 1) The wireless headphone of claim 1, wherein the PCB is configured to be electrically connected to the antenna via a pogo pin. ### Claim 4 (depends on 3) The wireless headphone of claim 3, wherein the pogo pin comprises a first end and a second end, and wherein: a first end of the pogo pin is configured to be mechanically coupled to the PCB; and a second end of the pogo pin is configured to contact the wireless headphone cap. ### Claim 5 (depends on 4) The wireless headphone of claim 4, wherein the wireless headphone cap comprises a first surface and a second surface, and wherein: the antenna is formed on the first surface of the wireless headphone cap; the second end of the pogo pin is configured to contact the second surface of the wireless headphone cap; and the first surface of the wireless headphone cap is electrically connected to the second surface of the wireless headphone cap through a via formed through the wireless headphone cap. ### Claim 6 (depends on 5) The wireless headphone of claim 5, wherein a length of a conductive path between the via and the PCB is approximately equal to a distance between the second surface of the wireless headphone cap and the PCB. ### Claim 7 (depends on 1) The wireless headphone of claim 1, wherein the PCB is configured to be directly mechanically connected to the wireless headphone cap using heat stakes. ### Claim 8 (depends on 7) The wireless headphone of claim 7, wherein a resonant frequency of the antenna corresponds directly to a distance between the PCB and the wireless headphone cap. ### Claim 9 (depends on 8) The wireless headphone of claim 8, wherein the distance between the PCB and the wireless headphone cap corresponds directly to a tolerance in a length of the heat stakes. ### Claim 10 A method of producing a wireless headphone, comprising: providing a wireless headphone cap including an antenna embedded in the wireless headphone cap; mechanically coupling a printed circuit board (PCB) directly to the wireless headphone cap at a fixed distance from the wireless headphone cap; electrically coupling the PCB to the antenna; and mechanically coupling the wireless headphone cap to a wireless headphone housing. ### Claim 11 (depends on 10) The method of claim 10, wherein electrically coupling the PCB to the antenna comprises: mechanically coupling a pogo pin to the PCB; and electrically coupling the pogo pin between the PCB and the antenna. ### Claim 12 (depends on 10) The method of claim 10, wherein the wireless headphone cap comprises heat stakes, and wherein mechanically coupling the PCB directly to the wireless headphone cap comprises: inserting the heat stakes through openings in the PCB; and heating the heat stakes to mechanically couple the heat stakes to the PCB. ### Claim 13 (depends on 12) The method of claim 12, wherein mechanically coupling the wireless headphone cap to the wireless headphone housing comprises mechanically coupling the wireless headphone cap to the wireless headphone housing subsequent to heating the heat stakes to mechanically couple the heat stakes to the PCB.