# US 11,115,567 B2 · Image capture assembly and aerial photographing aerial vehicle > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,115,567 B2 - Document ID: US11115567B2 - Status: Granted - Kind: B2 - Application number: 16/885,928 - Filed: 2020-05-28 - Published: 2020-09-17 - Granted: 2021-09-07 - Earliest claimed: 2015-11-23 - Assignees: Sz Dji Technology Co., Ltd. - Applicants: Sz Dji Technology Co., Ltd. - Inventors: Lei Zhang; Hao Liu; Lei Wang - Web page: https://patentgrep.com/patent/US11115567B2 ## CPC - H04N 23/51: Housings - G03B 17/55: with provision for heating or cooling, e.g. in aircraft - H04N 23/52: Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 7/20463: {Filling compound, e.g. potted resin} - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K 2201/10121: Optical component, e.g. opto-electronic component - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An image capture assembly includes a heat-conducting housing, a camera component in the heat-conducting housing, and a heat-conducting sheet. The heat-conducting sheet is attached to the camera component and arranged between the camera component and the heat-conducting housing to dissipate heat generated by the camera component to the heat-conducting housing. The heat-conducting sheet extends to a side wall of the camera component from a bottom side of the camera component. ## Claims ### Claim 1 An image capture assembly comprising: a heat-conducting housing; a camera component in the heat-conducting housing and including a plurality of side walls; and a heat-conducting sheet attached to the camera component and arranged between the camera component and the heat-conducting housing to dissipate heat generated by the camera component to the heat-conducting housing, the heat-conducting sheet extending to more than one of the plurality of side walls of the camera component from a bottom side of the camera component, a height of the heat-conducting sheet on each of the more than one of the plurality of side walls of the camera component being greater than a half of a height of each of the more than one of the plurality of side walls of the camera component. ### Claim 2 (depends on 1) The image capture assembly according to claim 1, wherein the heat-conducting sheet on the more than one of the plurality side walls of the camera component is in direct contact with the heat-conducting housing. ### Claim 3 (depends on 1) The image capture assembly according to claim 1, wherein the heat-conducting sheet on the more than one of the plurality side walls of the camera component is in indirect contact with the heat-conducting housing. ### Claim 4 (depends on 1) The image capture assembly according to claim 1, wherein the heat-conducting sheet on the more than one of the plurality side walls of the camera component is spaced apart from the heat-conducting housing and faces toward heat-conducting housing. ### Claim 5 (depends on 1) The image capture assembly according to claim 1, wherein: the camera component includes: a circuit board; and a lens component supported by the circuit board and including a lens housing for accommodating lenses; and the heat-conducting sheet extends to more than one of a plurality side walls of the lens housing from a side of the circuit board that faces away from the lens component. ### Claim 6 (depends on 5) The image capture assembly according to claim 5, wherein an inner wall of the lens housing includes threads. ### Claim 7 (depends on 5) The image capture assembly according to claim 5, wherein: the camera component further includes an image sensor supported by the circuit board, electrically coupled to the circuit board, and accommodated by the lens component; the lens housing includes a first open end and a second open end; and the circuit board seals the first open end of the lens housing, and the second open end of the lens housing is exposed through the heat-conducting housing. ### Claim 8 (depends on 7) The image capture assembly according to claim 7, further comprising: a circuit board adapter in the heat-conducting housing and electrically coupled to the circuit board. ### Claim 9 (depends on 8) The image capture assembly according to claim 8, wherein: the circuit board and the circuit board adapter are plugged together; and a heat-conducting filler is filled between the circuit board and the circuit board adapter. ### Claim 10 (depends on 9) The image capture assembly according to claim 9, wherein: the circuit board adapter includes an adapter plate and a plurality of electronic components; the adapter plate includes a first surface and a second surface opposite to each other; the plurality of electronic components are electrically arranged at the first surface; and the circuit board are plugged to the circuit board adapter at the first surface. ### Claim 11 (depends on 10) The image capture assembly according to claim 10, wherein: the circuit board includes one of a male connector and a female connector; the first surface includes another one of the male connector and the female connector; and the male connector is inserted in the female connector. ### Claim 12 (depends on 10) The image capture assembly according to claim 10, wherein the heat-conducting filler covers the plurality of electronic components. ### Claim 13 (depends on 10) The image capture assembly according to claim 10, wherein the heat-conducting tiller is a first heat-conducting filler; the image capture assembly further comprising: a heat sink arranged at the second surface and contacting the heat-conducting housing; and a second heat-conducting filler is filled between the heat sink and the second surface of the adapter plate. ### Claim 14 (depends on 13) The image capture assembly according to claim 13, wherein: the electronic components are first electronic components; the circuit board adapter includes a plurality of second electronic components; the plurality of second electronic components are electrically coupled to the second surface of the adapter plate; and the second heat-conducting filler completely covers the plurality of second electronic components. ### Claim 15 (depends on 14) The image capture assembly according to claim 14, wherein: the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body; the heat dissipation body is disposed at the second surface of the adapter plate; and the plurality of heat dissipation fins are spaced apart from each other and arranged at a side of the heat dissipation body facing away from the second surface of the adapter plate. ### Claim 16 (depends on 15) The image capture assembly according to claim 15, wherein: the heat-conducting housing includes a first housing and a second housing; and the first housing is coupled to the second housing to form an accommodating space for accommodating the camera component, the heat-conducting sheet, the circuit board adapter, and the heat sink. ### Claim 17 (depends on 16) The image capture assembly according to claim 16, wherein: the first housing includes a coupling portion and an accommodating portion extending outward from the coupling portion; the coupling portion is coupled to the second housing to form the accommodating space; the lens housing is accommodated in the accommodating portion; and the plurality of side walls of the lens housing are aligned with a plurality of side walls of the accommodating portion, respectively. ### Claim 18 (depends on 17) The image capture assembly according to claim 17, wherein: the accommodating portion includes a light inlet; the second open end is aligned with the light inlet; an inner wall of the second housing extends inwardly to form a flange; and the plurality of heat dissipation fins are supported by the flange. ### Claim 19 (depends on 18) The image capture assembly according to claim 18, wherein: the heat sink is coupled to the second housing; and an edge of the heat sink body is aligned with the inner wall of the second housing. ### Claim 20 (depends on 1) The image capture assembly according to claim 1, wherein: the heat-conducting housing includes a first housing and a second housing, the first housing including: a coupling portion coupled to the second housing to form an accommodating space; and an accommodating portion extending outward from the coupling portion, the accommodating portion including a light inlet; the camera component further includes: a circuit board; and a lens component supported by the circuit board and including a lens housing for accommodating lenses, the lens housing being accommodated in the accommodating portion, the lens housing including a first end sealed by the circuit board and a second end exposed through the heat-conducting housing, and the second open end being aligned with the light inlet; wherein the heat-conducting sheet extends to more than one of a plurality of side walls of the lens housing from a bottom side of the circuit board that faces away from the lens component.