# US 11,115,084 B2 · Isolated data transfer system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,115,084 B2 - Document ID: US11115084B2 - Status: Granted - Kind: B2 - Application number: 16/200,799 - Filed: 2018-11-27 - Published: 2020-05-28 - Granted: 2021-09-07 - Earliest claimed: 2018-11-27 - Assignees: Allegro MicroSystems, LLC - Applicants: Allegro MicroSystems, LLC; Commissariat à l'énergie atomique et aux énergies alternatives - Inventors: Alexander Latham; Claude Fermon; Myriam Pannetier-Lecoeur - Web page: https://patentgrep.com/patent/US11115084B2 ## CPC - H01F 19/08: Transformers having magnetic bias, e.g. for handling pulses - H04B 5/266: {One coil at each side, e.g. with primary and secondary coils} - H04B 5/72: for local intradevice communication - H04L 25/0268: {with modulation and subsequent demodulation} - H04L 25/0272: {Arrangements for coupling to multiple lines, e.g. for differential transmission} - H04B 5/22: Capacitive coupling - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H04B: TRANSMISSION - H04L: TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION (arrangements common to telegraphic and telephonic communication H04M) ## Abstract Methods and apparatus for providing data transfer with a drive coil to transmit information, a receive coil magnetically coupled to the drive coil, and a first magnetoresistive sensor proximate the receive coil to detect information from the receive coil. In embodiments, the drive and receive coils are separated by an isolation material. In embodiments, a signal isolator IC packages includes transmit and receive coils and a magnetic field sensing element coupled to the receive coil. ## Claims ### Claim 1 A system, comprising: a drive coil to transmit information; a receive coil magnetically coupled to the drive coil for receiving the information from the drive coil; and a first magnetic field sensing element proximate the receive coil to detect the information from the receive coil, wherein the receive coil includes a first narrowed portion for concentrating magnetic field generated by the current through the receive coil on the first magnetic field sensing element. ### Claim 2 (depends on 1) The system according to claim 1, further including a second magnetic field sensing element, wherein the receive coil includes a second narrowed portion, wherein the second magnetic field sensing element is proximate the second narrowed portion. ### Claim 3 (depends on 2) The system according to claim 2, wherein the first and second narrowed regions are located for coupling to the first and second magnetic field sensing elements differentially, which has a bridge configuration. ### Claim 4 (depends on 1) The system according to claim 1, wherein the first narrowed portion is located outside of an area of the drive coil. ### Claim 5 (depends on 1) The system according to claim 1, further including a die to support the first magnetic field sensing element. ### Claim 6 (depends on 5) The system according to claim 5, wherein the die supports the drive and receive coils. ### Claim 7 (depends on 5) The system according to claim 5, wherein the die incudes circuitry to process information from the first magnetic field sensing element. ### Claim 8 (depends on 1) The system according to claim 1, wherein the receive coil has one turn. ### Claim 9 (depends on 1) The system according to claim 1, wherein the receive coil has less than five turns. ### Claim 10 (depends on 1) The system according to claim 1, wherein the drive coil includes first and second coils coupled in series. ### Claim 11 (depends on 1) The system according to claim 1, wherein the receive coil is connected to ground. ### Claim 12 (depends on 1) The system according to claim 1, wherein the first magnetic field sensing element comprises a GMR element. ### Claim 13 (depends on 1) The system according to claim 1, wherein the first magnetic field sensing element comprises a TMR element. ### Claim 14 (depends on 1) The system according to claim 1, wherein the drive coil is isolated from the receive coil and the magnetic field sensing element. ### Claim 15 (depends on 14) The system according to claim 14, wherein the isolation comprises electrical and/or galvanic isolation. ### Claim 16 A signal isolator IC package, comprising: a drive coil to transmit information; a receive coil magnetically coupled to the drive coil for receiving the information from the drive coil; and a first magnetic field sensing element proximate the receive coil to detect the information from the receive coil, wherein the receive coil includes a first narrowed portion for concentrating magnetic field generated by the current through the receive coil on the first magnetic field sensing element. ### Claim 17 (depends on 16) The IC package according to claim 16, further including isolation between the drive coil and receive coil. ### Claim 18 (depends on 16) The IC package according to claim 16, further including a second magnetic field sensing element, wherein the receive coil includes a second narrowed portion, wherein the second magnetic field sensing element is proximate the second narrowed portion. ### Claim 19 (depends on 18) The IC package according to claim 18, wherein the first and second narrowed portions are located for coupling to the first magnetic field sensing element, which has a bridge configuration. ### Claim 20 (depends on 16) The IC package according to claim 16, wherein the first narrowed portion is located outside of an area of the drive coil. ### Claim 21 (depends on 16) The IC package according to claim 16, further including a die to support the first magnetic field sensing element. ### Claim 22 (depends on 16) The IC package according to claim 16, further including a transistor bridge coupled to the drive coil. ### Claim 23 (depends on 16) The IC package according to claim 16, further including first and second die separated by a barrier region. ### Claim 24 (depends on 23) The IC package according to claim 23, wherein the transistor bridge is disposed on the first die and the drive and receive coils are disposed on the second die. ### Claim 25 (depends on 24) The IC package according to claim 24, wherein the first magnetic field sensing element sensor is disposed on the second die. ### Claim 26 (depends on 22) The IC package according to claim 22, wherein the transistor bridge is coupled to a first input pin and the first magnetic field sensing element is coupled to a first output pin. ### Claim 27 A method, comprising: employing a drive coil to transmit information; employing a receive coil magnetically coupled to the drive coil for receiving the information from the drive coil; and employing a first magnetic field sensing element proximate the receive coil to detect the information from the receive coil, wherein the receive coil includes a first narrowed portion for concentrating magnetic field generated by the current through the receive coil on the first magnetic field sensing element. ### Claim 28 (depends on 27) The method according to claim 27, further including employing a second magnetic field sensing element, wherein the receive coil includes a second narrowed portion, wherein the second magnetic field sensing element is proximate the second narrowed portion. ### Claim 29 (depends on 28) The method according to claim 28, wherein the first and second narrowed portions are located for coupling to the first and second magnetic field sensing elements differentially, which has a bridge configuration.