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US 11,115,029 B2Granted
Integrated circuit device, oscillator, electronic apparatus, and vehicle
AssigneeSeiko Epson Corporation
InventorsYosuke Itasaka, Naoki Il, Takashi Nomiya
Life of this patent
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Abstract
An integrated circuit device includes a temperature sensor, a heat generation source circuit serving as a heat generation source, a pad for external coupling, and a capacitor having the MIM structure in which one electrode is electrically coupled to the pad for external coupling. In a plan view orthogonal to the substrate on which a circuit element is formed, the capacitor having the MIM structure and the temperature sensor overlap.
Claims15
An integrated circuit device comprising:
- a temperature sensor;
- a heat generation source circuit serving as a heat generation source;
- a pad for external coupling;
- and
- a capacitor having a metal-insulator-metal (MIM) structure in which one electrode is electrically coupled to the pad for external coupling, wherein
- the capacitor having the MIM structure and the temperature sensor overlap in a plan view orthogonal to a substrate on which a circuit element is formed.
3 more elements
An integrated circuit device comprising:
- a temperature sensor;
- a heat generation source circuit serving as a heat generation source;
- a pad for external coupling which is a ground pad or a power supply pad;
- and
- a capacitor having a metal-insulator-metal (MIM) structure in which one electrode is electrically coupled to the pad for external coupling, wherein
- the capacitor having the MIM structure and the heat generation source circuit overlap in a plan view orthogonal to a substrate on which a circuit element is formed.
3 more elements
Dependencies are inferred from the claim text.