# US 11,114,819 B2 · Laser carrier-on-chip device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,819 B2 - Document ID: US11114819B2 - Status: Granted - Kind: B2 - Application number: 16/555,363 - Filed: 2019-08-29 - Published: 2020-03-05 - Granted: 2021-09-07 - Earliest claimed: 2018-08-30 - Assignees: Finisar Sweden AB - Applicants: Finisar Sweden AB - Inventors: Andrei Kaikkonen; Lukasz Kumanowski; Nicolae Chitica; David Adams - Web page: https://patentgrep.com/patent/US11114819B2 ## CPC - H01S 5/0261: {Non-optical elements, e.g. laser driver components, heaters (H01S5/0265 takes precedence)} - H01S 5/0427: {for applying modulation to the laser} - H01S 5/023: Mount members, e.g. sub-mount members - H01S 5/02315: Support members, e.g. bases or carriers - H01S 5/0233: Mounting configuration of laser chips - H01S 5/02345: Wire-bonding - H01S 5/0235: Method for mounting laser chips - H01S 5/0265: {Intensity modulators (intra-cavity modulators H01S5/0625)} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract A semiconductor laser chip-on-carrier (CoC) device comprising: a semiconductor laser component comprising an electric laser terminal; a driver circuit for producing on an electric driver terminal an alternating current electric driving signal; and an electric signal conductor electrically connecting the driver terminal to the laser terminal, wherein the electric signal conductor comprises: a first printed trace which is not arranged on the semiconductor laser component and which comprises a first trace elongated section and a first trace downstream terminal section; and a first wire bond, connecting the first trace downstream terminal section to the laser terminal, and wherein the first trace elongated section is adapted to the semiconductor laser component such that the first trace elongated section and an internal capacitance of the semiconductor is laser component together correspond to an impedance which is at the most 20% from an output impedance of an output terminal of the driver circuit. ## Claims ### Claim 1 A semiconductor laser chip-on-carrier (CoC) device comprising: a semiconductor laser component arranged in the form of a laser chip mounted on a semiconductor carrier, the semiconductor laser component comprising an electric laser terminal; a driver circuit for producing on an electric driver terminal an alternating current electric driving signal, the electric driver terminal having an output impedance; and an electric signal conductor electrically connecting the electric driver terminal to the electric laser terminal, wherein the electric signal conductor comprises: a first printed trace, which first printed trace is not arranged on the semiconductor laser component and which first printed trace comprises a first trace elongated section and a first trace downstream terminal section; and a first wire bond, connecting the first trace downstream terminal section to the electric laser terminal, and wherein the first trace elongated section is adapted to the semiconductor laser component such that the first trace elongated section and an internal capacitance of the semiconductor laser component together correspond to an input impedance which is at most 20% from the output impedance of the electric driver terminal of the driver circuit. ### Claim 2 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein the first trace downstream terminal section, the first wire bond and the electric laser terminal together correspond to a first impedance which is also at most 20% from the output impedance of the electric driver terminal of the driver circuit. ### Claim 3 (depends on 2) The semiconductor laser CoC device according to claim 2, wherein the first printed trace is arranged on the semiconductor carrier. ### Claim 4 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein the first printed trace further comprises: an upstream first trace upstream terminal section, wherein the electric signal conductor further comprises a second printed trace, which second printed trace is also not arranged on the semiconductor laser component and which second printed trace comprises a second trace elongated section and a second trace downstream terminal section; and a second wire bond, connecting the second trace downstream terminal section to the first trace upstream terminal section, and wherein the second trace downstream terminal section, the second wire bond and first trace upstream terminal section together correspond to a second impedance which is also at most 20% from the output impedance of the electric driver terminal of the driver circuit. ### Claim 5 (depends on 4) The semiconductor laser CoC device according to claim 4, wherein the second printed trace is arranged on a Printed Circuit Board (PCB) on which the driver circuit is also arranged. ### Claim 6 (depends on 4) The semiconductor laser CoC device according to claim 4, wherein the second trace elongated section is directly connected to the electric driver terminal. ### Claim 7 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein the output impedance of the electric driver terminal of the driver circuit is 50 Ohms+/−20%. ### Claim 8 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein a first impedance of the first trace downstream terminal section is lower than the output impedance of the electric driver terminal of the driver circuit. ### Claim 9 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein a first impedance of the first trace elongated section is higher than the output impedance of the electric driver terminal of the driver circuit. ### Claim 10 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein first trace downstream terminal section is formed as a local widening of the first printed trace. ### Claim 11 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein the semiconductor laser component is arranged to emit 1310 nm laser light. ### Claim 12 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein the semiconductor laser component is an Electro-absorption Modulated Laser (EML), a Directly Modulated Laser (DML) or a Distributed Feedback Laser which is modulated using a Mach Zehnder Modulator (DFB-MZM) laser component. ### Claim 13 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein the driver circuit is arranged to, via said driving signal, achieve modulation of laser light emitted by the semiconductor laser component at a modulation frequency of at least 50 gigabits per second (Gbps). ### Claim 14 (depends on 13) The semiconductor laser CoC device according to claim 13, wherein the modulation is a Pulse Amplitude Modulation (PAM) modulation. ### Claim 15 (depends on 14) The semiconductor laser CoC device according to claim 14, wherein the PAM modulation is a PAM4 modulation. ### Claim 16 (depends on 1) The semiconductor laser CoC device according to claim 1, wherein a combined impedance of the first trace elongated section and the semiconductor laser component is at most 20% from the output impedance of the electric driver terminal of the driver circuit.