# US 11,114,782 B2 · Method of manufacturing circuit board structure

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- Number: US 11,114,782 B2
- Document ID: US11114782B2
- Status: Granted
- Kind: B2
- Application number: 16/540,038
- Filed: 2019-08-13
- Published: 2020-11-19
- Granted: 2021-09-07
- Earliest claimed: 2019-05-14
- Assignees: Unimicron Technology Corp.
- Applicants: Unimicron Technology Corp.
- Inventors: Tzyy-Jang Tseng; Pei-Wei Wang; Ching-Ho Hsieh; Shao-Chien Lee; Kuo-Wei Li
- Web page: https://patentgrep.com/patent/US11114782B2

## CPC

- H01R 12/62: connecting to rigid printed circuits or like structures
- H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers}
- H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)}
- H05K 1/036: {Multilayers with layers of different types}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)
- H05K 3/0011: {Working of insulating substrates or insulating layers}
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}
- H05K 3/4688: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)}
- H05K 2201/0141: Liquid crystal polymer [LCP]
- H05K 2201/015: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H05K 2201/0154: Polyimide
- H05K 2201/0158: Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

## Claims

### Claim 1

A method of manufacturing circuit board structure, comprising:
providing a first flexible circuit board and a second flexible circuit board, the first flexible circuit board comprising a first dielectric layer and a first conductive circuit on the first dielectric layer, the second flexible circuit board comprising a second dielectric layer and a second conductive circuit on the second dielectric layer, wherein the first dielectric layer has a first dielectric loss value, and the second dielectric layer has a second dielectric loss value;
disposing a rigid board structure connecting the first flexible circuit board and the second flexible circuit board, wherein the rigid board structure comprises:
a third dielectric layer having a third dielectric loss value less than each of the first dielectric loss value and the second dielectric loss value, wherein the third dielectric loss value ranges from 0.001 to 0.002;
a first metal layer on the third dielectric layer; and
a first hole and a second hole both in the third dielectric layer and penetrating through the first metal layer to respectively expose the first conductive circuit and the second conductive circuit;
respectively forming a first conductive plug and a second conductive plug in the first hole and the second hole, the first conductive plug and the second conductive plug respectively connecting the first conductive circuit and the second conductive circuit;
patterning the first metal layer to form a first patterned metal layer;
forming a fourth dielectric layer and a second metal layer on the first patterned metal layer, wherein the fourth dielectric layer is located between the first patterned metal layer and the second metal layer;
forming a plurality of third holes penetrating through the fourth dielectric layer and the second metal layer to expose the first patterned metal layer;
forming a plurality of third conductive plugs filling the third holes; and
patterning the second metal layer to form a second patterned metal layer.

### Claim 2 (depends on 1)

The method of claim 1, further comprising:
disposing a shielding layer over the first patterned metal layer after forming the first patterned metal layer.

### Claim 3 (depends on 1)

The method of claim 1, wherein the first flexible circuit board further comprises a first cover layer partially covering the first conductive circuit, and a portion of the first cover layer is covered by the rigid board structure.

### Claim 4 (depends on 1)

The method of claim 1, wherein the second flexible circuit board further comprises a second cover layer partially covering the second conductive circuit, and a portion of the second cover layer is covered by the rigid board structure.