# US 11,114,747 B2 · Antenna including conductive pattern and electronic device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,747 B2 - Document ID: US11114747B2 - Status: Granted - Kind: B2 - Application number: 16/441,376 - Filed: 2019-06-14 - Published: 2019-12-19 - Granted: 2021-09-07 - Earliest claimed: 2018-06-14 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Chungkyun Ham; Seunggil Jeon; Jaehun Jung; Youngsik Kim - Web page: https://patentgrep.com/patent/US11114747B2 ## CPC - H01Q 1/243: {with built-in antennas} - H01Q 5/42: using two or more imbricated arrays (H01Q5/49 takes precedence) - H01Q 9/065: {Microstrip dipole antennas (patch antenna H01Q9/0407)} - H01Q 9/42: with folded element, the folded parts being spaced apart a small fraction of the operating wavelength - H01Q 21/065: {Patch antenna array} - H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} - H04B 1/3816: Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices - H04B 1/3888: Arrangements for carrying or protecting transceivers - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors - H05K 1/165: {incorporating printed inductors} - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10265: Metallic coils or springs, e.g. as part of a connection element - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H04B: TRANSMISSION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a first PCB disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate, at least one conductive plate formed on the second face, a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate, a first wireless communication circuit mounted on a first face of the first PCB, electrically coupled to the conductive plate and the first conductive pattern. ## Claims ### Claim 1 An electronic device comprising: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate; a first printed circuit board (PCB) disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate; at least one conductive plate formed on the second face; a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate; a first wireless communication circuit mounted on a first face of the first PCB, electrically coupled to the conductive plate and the first conductive pattern, and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 6 GHz to 100 GHz; a dielectric structure disposed on the first face between the conductive plate and the side member when viewed from above the first plate; a second conductive pattern constructed on one face of the dielectric structure or embedded at least partially inside thereof; and a second wireless communication circuit electrically coupled to the second conductive pattern and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 0.5 GHz to 6 GHz. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein the second wireless communication circuit is configured to support a Wi-Fi protocol. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein the first conductive pattern forms a dipole antenna. ### Claim 4 (depends on 1) The electronic device of claim 1, further comprising a display disposed inside the space and visible through a portion of the first plate. ### Claim 5 (depends on 1) The electronic device of claim 1, wherein the dielectric structure is disposed between the first plate and the first conductive pattern. ### Claim 6 (depends on 1) The electronic device of claim 1, wherein the second conductive pattern is disposed at a location spaced apart from the at least one conductive plate in the dielectric structure so as to satisfy a specified radiation efficiency. ### Claim 7 (depends on 1) The electronic device of claim 1, wherein the dielectric structure is disposed at a location at least partially overlapping with the first conductive pattern when viewed from above the first plate. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the dielectric structure comprises: a first face facing the first plate; a second face facing the first face of the first PCB; and a side face surrounding the first face and the second face, and wherein the side face comprises: a first side face facing the side member; a second side face facing away from the first side face; a third side face connecting the first side face and one end of the second side face; and a fourth side face connecting the first side face and other end of the second side face. ### Claim 9 (depends on 8) The electronic device of claim 8, wherein the second conductive pattern is disposed on the first face of the dielectric structure. ### Claim 10 (depends on 8) The electronic device of claim 8, wherein the second conductive pattern is disposed on the dielectric structure to be extended through at least two faces among the first face, the second face, the first side face, the second side face, the third side face, or the fourth side face. ### Claim 11 (depends on 8) The electronic device of claim 8, wherein the second conductive pattern is disposed on each of at least two faces among the first face, the second face, the first side face, the second side face, the third side face, or the fourth side face. ### Claim 12 (depends on 1) The electronic device of claim 1, wherein the conductive plate is disposed such that a beam pattern is formed in a direction of the second plate, and the first conductive pattern is disposed such that a beam pattern is formed in a direction of the side member. ### Claim 13 (depends on 1) The electronic device of claim 1, wherein the first conductive pattern comprises: a first antenna element disposed in a direction of the side member at an edge region of the first PCB; a second antenna element disposed with a specific interval from the first antenna element; a third antenna element disposed between the first antenna element and the second antenna element; and a fourth antenna element disposed with a specific interval in a horizontal direction from the third antenna element. ### Claim 14 (depends on 13) The electronic device of claim 13, wherein the first antenna element and the second antenna element are constructed in a form of a conductive patch. ### Claim 15 (depends on 1) The electronic device of claim 1, further comprising a second PCB disposed between the first plate and the second plate, wherein the second wireless communication circuit is mounted to the second PCB. ### Claim 16 (depends on 15) The electronic device of claim 15, wherein the second conductive pattern is electrically coupled to the second PCB by means of an electrical coupling member when the second PCB is disposed to the space of the electronic device. ### Claim 17 (depends on 15) The electronic device of claim 15, wherein the first PCB is disposed to at least partially overlap with the second PCB. ### Claim 18 (depends on 1) The electronic device of claim 1, wherein the second conductive pattern is constructed using a conductive plate attached to the dielectric structure, a conductive paint coated on the first dielectric structure, or laser direct structuring (LDS) in the dielectric structure. ### Claim 19 (depends on 1) The electronic device of claim 1, wherein the first wireless communication circuit includes a radio frequency integrated circuit (RFIC). ### Claim 20 (depends on 19) The electronic device of claim 19, further comprising an intermediate frequency integrated circuit (IFIC) electrically coupled to the first wireless communication circuit.