# US 11,114,604 B2 · Method of manufacturing MEMS device and MEMS device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,604 B2 - Document ID: US11114604B2 - Status: Granted - Kind: B2 - Application number: 16/044,734 - Filed: 2018-07-25 - Published: 2019-01-31 - Granted: 2021-09-07 - Earliest claimed: 2017-07-27 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Yoshiki Sugawara; Takeshi Yasoshima; Miyuki Muramoto - Web page: https://patentgrep.com/patent/US11114604B2 ## CPC - H10N 30/03: Assembling devices that include piezoelectric or electrostrictive parts - B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm} - B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm} - B41J 2/1623: {bonding and adhesion} - B41J 2/1629: {wet etching} - B41J 2/1635: {dividing the wafer into individual chips} - B41J 2/1646: {thin film formation by sputtering} - B81C 1/00095: {Interconnects} - B81C 1/00134: {comprising flexible or deformable structures (manufacture of MEMS devices for specific applications, see relevant places, e.g. gyroscopes G01C19/5719, pressure sensors G01L9/0042, accelerometers G01P15/0802, acoustic transducers or diaphragms therefor H04R31/00)} - H10N 30/06: Forming electrodes or interconnections, e.g. leads or terminals - H10N 30/079: using intermediate layers, e.g. for growth control - H10N 30/2047: {Membrane type} - H10N 30/708: {Intermediate layers, e.g. barrier, adhesion or growth control buffer layers} - H10N 30/875: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins} - B41J 2002/14241: {having a cover around the piezoelectric thin film element} - B41J 2002/14419: {Manifold} - B41J 2002/14491: {Electrical connection} - B81B 2201/03: Microengines and actuators - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract Provided is a method of manufacturing a MEMS device including forming, in a metal layer, an opening that enables a first space and a second space to communicate with each other by exposing the metal layer to an etching solution in a state where the metal layer is left at a boundary between the first space and the second space, and covering an inner surface of an opening of each of an adhesive layer and the metal layer by forming a protective layer from an inner surface of the first space to an inner surface of the second space after the opening of the metal layer is formed. ## Claims ### Claim 1 A MEMS device in which a first member, on which a metal layer is stacked and in which a first space is formed, and a second member, in which a second space communicating with the first space is formed, are joined via an adhesive layer, comprising: a first opening formed in a communication portion of the first space that enables communication with the second space; a second opening formed in a communication portion of the second space that enables communication with the first space; a third opening formed in the metal layer in a communication portion between the first space and the second space to enable the first space and the second space to communicate with each other; a fourth opening formed in the adhesive layer in a communication portion between the first space and the second space to enable the first space and the second space to communicate with each other; and a protective layer covering an inner surface of each of the first opening, the second opening, the third opening, and the fourth opening, wherein an opening width of the third opening in one direction is wider than an opening width of the first opening in the one direction and an opening width of the second opening in the one direction, and an opening width of the fourth opening in the one direction is narrower than the opening width of the first opening in the one direction and the opening width of the second opening in the one direction, wherein the third opening is partially formed by a gap formed between the metal layer and the adhesive layer, and wherein an amount of the protective layer disposed in the gap is thicker than an amount of the protective layer not disposed in the gap. ### Claim 2 (depends on 1) The MEMS device according to claim 1, wherein a contact layer is formed between the metal layer and the first member. ### Claim 3 (depends on 2) The MEMS device according to claim 2, wherein the contact layer is formed of nickel (Ni), chromium (Cr), titanium (Ti), titanium tungsten (TiW), or nickel chromium (NiCr). ### Claim 4 (depends on 1) The MEMS device according to claim 1, wherein a pressure chamber is formed in the first member, wherein a housing space is formed in the second member, wherein a piezoelectric element is housed in the housing space, and wherein a vibration plate is provided between the pressure chamber and the piezoelectric element. ### Claim 5 (depends on 1) The MEMS device according to claim 1, wherein gold (Au) is used for the metal layer. ### Claim 6 (depends on 5) The MEMS device according to claim 5, wherein a layer of nickel chromium (NiCr) is formed between the metal layer and the first member. ### Claim 7 (depends on 1) The MEMS device according to claim 1, wherein tantalum oxide (TaOx) is used for the protective layer. ### Claim 8 (depends on 1) The MEMS device according to claim 1, wherein a nozzle plate having a nozzle formed thereon is joined to the first member so that the communication portions and the nozzle communicate with each other through the pressure chamber. ### Claim 9 (depends on 8) The MEMS device according to claim 8, wherein a liquid flows between the nozzle and the communication portions.