Electronic devices including solid semiconductor dies

An electronic film device comprising:

• a layer of polymer matrix material, the layer having opposite first and second major surfaces;
• an array of solid semiconductor dies being at least partially embedded in the layer, the dies each extending between a first end and a second end thereof, the first ends each having a projected portion projecting away from the first major surface of the layer with a step having an average height of about 1 to about 25 micrometers;
• and
• a first electrical conductor connecting the first ends of the array of dies, the first electoral conductor extending on the first major surface of the layer and having opposite ends covering the projected portions of the adjacent first ends.

A flexible thermoelectric module comprising:

• a layer of flexible polymer material, the layer having opposite first and second major surfaces;
• an array of solid thermoelectric dies being at least partially embedded in the layer, the dies each extending between a first end and a second end thereof, both ends being exposed from the layer of flexible polymer material, at least one of the first and second ends each having a projected portion projecting away from the layer with a step having an average height of about 1 to about 25 micrometers;
• a first electrical conductor extending on the first major surface of the layer to connect the first ends of the array of dies, the first electoral conductor having opposite ends to cover the projected portions of the adjacent first ends;
• and
• a second electrical conductor extending on the second major surface of the layer to connect the second ends of the array of dies, the second electoral conductor having opposite ends to cover the projected portions of the adjacent second ends.