# US 11,114,597 B2 · Display device having an electronic device disposed on a first pad and a second pad

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- Number: US 11,114,597 B2
- Document ID: US11114597B2
- Status: Granted
- Kind: B2
- Application number: 16/554,675
- Filed: 2019-08-29
- Published: 2019-12-19
- Granted: 2021-09-07
- Earliest claimed: 2018-03-22
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Jia-Yuan Chen; Tsung-Han Tsai; Kuan-Feng Lee; Yuan-Lin Wu
- Web page: https://patentgrep.com/patent/US11114597B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- B23K 35/262: {Sn as the principal constituent}
- B23K 35/30: with the principal constituent melting at less than 1550°C
- B23K 35/32: with the principal constituent melting at more than 1550°C
- H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)}
- H05K 1/181: associated with surface mounted components
- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10D 86/60: wherein the TFTs are in active matrices
- H10H 20/018: {Bonding of wafers}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/072: {of bump connectors}
- H10W 90/00: Package configurations
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- B23K 35/26: with the principal constituent melting at less than 400°C
- H10H 20/0137: {the light-emitting regions comprising nitride materials}
- H10H 20/032: {of electrodes}
- H10H 20/034: {of coatings}
- H10H 20/0364: {of interconnections}
- H10H 20/812: within the light-emitting regions, e.g. having quantum confinement structures
- H10H 20/825: containing nitrogen, e.g. GaN
- H10H 20/832: characterised by their material
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/234: {Cross-sectional shape, i.e. in side view}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/354: {comprising polymers}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A display device is provided. The display device includes a substrate and a first metal line and a second metal line disposed on the substrate. The display device includes a first pad and a second pad disposed on the substrate and electrically connected to the first metal line and the second metal line respectively. The display device further includes an electronic device disposed on the first pad and the second pad. The electronic device includes a first connecting post and a second connecting post, wherein a distance between the first connecting post and the second connecting post is in a range from 1 um to 200 um. A portion of the first connecting post is embedded in the first pad and a portion of the second connecting post is embedded in the second pad.

## Claims

### Claim 1

A display device, comprising:
a substrate;
a first metal line and a second metal line disposed on the substrate;
a first pad and a second pad disposed on the substrate and electrically connected to the first metal line and the second metal line respectively; and
an electronic device disposed on the first pad and the second pad, and the electronic device comprising a first connecting post and a second connecting post;
wherein a portion of the first connecting post is embedded in the first pad and a portion of the second connecting post is embedded in the second pad, and a topmost height of the first pad from the substrate is higher than a topmost height of the first metal line from the substrate along a normal direction of the substrate;
wherein the first connecting post does not overlap the first metal line in the normal direction of the substrate, wherein the first pad overlaps only one edge of the first metal line in a cross-sectional view, and the second pad overlaps only one edge of the second metal line in the cross-sectional view.

### Claim 2 (depends on 1)

The display device as claimed in claim 1, wherein a distance between the first connecting post and the second connecting post is in a range from 1 μm to 200 μm.

### Claim 3 (depends on 1)

The display device as claimed in claim 1, wherein the first pad overlaps the first metal line along the normal direction of the substrate.

### Claim 4 (depends on 1)

The display device as claimed in claim 1, wherein a material of the first pad comprises solder materials, tin, indium, gallium, tin alloys, indium alloys, gallium alloys, gallium-indium alloys or a combination thereof.

### Claim 5 (depends on 1)

The display device as claimed in claim 1, wherein the first pad comprises a bulging portion around the portion of the first connecting post that is embedded in the first pad.

### Claim 6 (depends on 5)

The display device as claimed in claim 5, wherein a thickness of the first pad at the bulging portion is greater than a thickness of the first pad out of the bulging portion.

### Claim 7 (depends on 1)

The display device as claimed in claim 1, wherein the first connecting post partially penetrates the first pad, and the second connecting post partially penetrates the second pad.

### Claim 8 (depends on 1)

The display device as claimed in claim 1, wherein a ratio of a height of the portion of the first connecting post that is embedded in the first pad to a height of the first connecting post is greater than or equal to 0.1 and less than or equal to 1.

### Claim 9 (depends on 1)

The display device as claimed in claim 1, further comprising an adhesive layer disposed between the electronic device and the substrate.

### Claim 10 (depends on 9)

The display device as claimed in claim 9, wherein the adhesive layer comprises a swelling portion near the portion of the first connecting post that is embedded in the first pad.

### Claim 11 (depends on 9)

The display device as claimed in claim 9, wherein the adhesive layer covers at least a portion of the first pad.

### Claim 12 (depends on 9)

The display device as claimed in claim 9, wherein the electronic device comprises a conductive layer, and the conductive layer directly contacts the adhesive layer.

### Claim 13 (depends on 9)

The display device as claimed in claim 9, wherein the adhesive layer is an insulator.

### Claim 14 (depends on 1)

The display device as claimed in claim 1, wherein the electronic device comprises a conductive layer, and the first connecting post and the conductive layer are integrally formed.

### Claim 15 (depends on 1)

The display device as claimed in claim 1, wherein the first connecting post includes a first layer and a second layer.

### Claim 16 (depends on 1)

The display device as claimed in claim 1, wherein a melting temperature of the first connecting post is higher than a melting temperature of the first pad.

### Claim 17 (depends on 1)

The display device as claimed in claim 1, wherein the first connecting post does not directly contact the first metal line, and the second connecting post does not directly contact the second metal line.

### Claim 18 (depends on 1)

The display device as claimed in claim 1, wherein the first pad and the second pad partially overlap the first metal line and the second metal line respectively along the normal direction of the substrate.