# US 11,114,596 B2 · Light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,596 B2 - Document ID: US11114596B2 - Status: Granted - Kind: B2 - Application number: 16/373,473 - Filed: 2019-04-02 - Published: 2019-07-25 - Granted: 2021-09-07 - Earliest claimed: 2015-06-01 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Yoshikazu Matsuda; Ryo Suzuki - Web page: https://patentgrep.com/patent/US11114596B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/851: Wavelength conversion means - H10H 20/853: characterised by their shape - H10H 20/8581: {characterised by their material} - H10H 20/8585: {being an interconnection} - H10W 72/00: Interconnections or connectors in packages - H10W 72/072: {of bump connectors} - H10W 74/014: {using batch processing} - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10H 20/0365: {of means for heat extraction or cooling} - H10W 72/01931: {using blanket deposition} - H10W 72/01951: {Changing the shapes of bond pads} - H10W 72/0198: {batch processes} - H10W 72/07354: {changes in dispositions} - H10W 72/242: {relative to the surface, e.g. recessed, protruding} - H10W 72/348: {Top-view layouts, e.g. mirror arrays} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/923: {Bond pads having multiple stacked layers} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/9413: {on encapsulations} - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A light-emitting device includes: a light-emitting element; a coating member that covers the light-emitting element; and two external connection electrodes exposed form a first surface of the coating member. Each of the external connection electrodes includes an electrode buried in the coating member; and a metal layer formed on the electrode. A surface of each of the metal layers is exposed from the first surface of the coating member. The first surface of the coating member includes a plurality of grooves between the external connection electrodes. ## Claims ### Claim 1 A light emitting device comprising: a light-emitting element having a first surface and a second surface opposite each other, the light-emitting element comprising a pair of external connecting electrodes on the first surface, each of the external connecting electrodes comprising an electrode formed on the first surface and a metal layer formed on the electrode, a wavelength conversion member covering the second surface of the light-emitting element, and a coating member covering the first surface except for the external connecting electrodes, wherein the coating member comprises a light reflective material and resin, and wherein a laser irradiation mark is formed on a surface of the coating member. ### Claim 2 (depends on 1) The light emitting device according to claim 1, further comprising a light transmissive member covering a lateral surface of the light-emitting element. ### Claim 3 (depends on 1) The light-emitting device according to according to claim 1, wherein the laser irradiation mark has a depth in a range of 0.2 to 3 μm. ### Claim 4 (depends on 1) The light-emitting device according to according to claim 1, wherein a shape of one of the pair of external electrodes is different from a shape of the other of the pair of external connection electrodes. ### Claim 5 (depends on 1) The light-emitting device according to claim 1, wherein each of the electrodes comprises copper, and each of the metal layers comprises a stack of a nickel layer and a gold layer. ### Claim 6 (depends on 1) The light-emitting device according to claim 1, wherein a side surface of the light-emitting device includes a part of a surface of the coating member. ### Claim 7 (depends on 2) The light-emitting device according to claim 2, wherein a side surface of the light-emitting device includes a part of a surface of the coating member. ### Claim 8 (depends on 1) The light-emitting device according to claim 1, further comprising a light shielding member covering a side surface of the wavelength conversion member. ### Claim 9 (depends on 2) The light-emitting device according to claim 2, further comprising a light shielding member covering a side surface of the wavelength conversion member. ### Claim 10 (depends on 1) The light-emitting device according to claim 1, wherein each of the pair of external connecting electrodes has long sides and short sides in a plan view, and wherein one long side of one of the pair of electrodes includes a concave portion. ### Claim 11 (depends on 1) The light-emitting device according to claim 1, wherein one of the pair of external connecting electrodes has a plurality of concave portions on a side opposing the other of the pair of external connecting electrodes. ### Claim 12 A light emitting device comprising: a light-emitting element having a first surface and a second surface opposite each other, the light-emitting element comprising a pair of external connecting electrodes on the first surface, each of the external connecting electrodes comprising an electrode formed on the first surface and a metal layer formed on the electrode, a wavelength conversion member covering the second surface of the light-emitting element, and a coating member covering the first surface except for the external connecting electrodes, wherein a laser irradiation mark is formed on a surface of the coating member, and wherein the laser irradiation mark has a depth in a range of 0.2 to 3 μm. ### Claim 13 A light emitting device comprising: a light-emitting element having a first surface and a second surface opposite each other, the light-emitting element comprising a pair of external connecting electrodes on the first surface, each of the external connecting electrodes comprising an electrode formed on the first surface and a metal layer formed on the electrode, a wavelength conversion member covering the second surface of the light-emitting element, and a coating member covering the first surface except for the external connecting electrodes, wherein a laser irradiation mark is formed on a surface of the coating member, and wherein a shape of one of the pair of external electrodes is different from a shape of the other of the pair of external connection electrodes.