Optoelectronic modules and optoelectronic molding tools and processes for manufacturing the same

A method for manufacturing a plurality of discrete optoelectronic modules from a wafer assembly, the method comprising:

• adding a substrate wafer to the wafer assembly, the substrate wafer including a plurality of optoelectronic components mounted to a first side of the substrate wafer;
• coating the first side of the substrate wafer and the plurality of optoelectronic components with a photosensitive material, the plurality of optoelectronic components being sensitive to and/or operable to emit electromagnetic radiation of a particular wavelength;
• exposing a first side of the photosensitive material to electromagnetic radiation such that a plurality of defining portions is formed within the photosensitive material, each defining portion at least partially delineating dimensions of at least one optical channel associated with at least one of the optoelectronic components;
• developing the photosensitive material such that the photosensitive material that is not the plurality of defining portions is removed from the wafer assembly;
• mounting a back-fill wafer to the plurality of defining portions, the backfill wafer including a plurality of channels and defining, at least partially, a plurality of cavities adjacent to the plurality of defining portions;
• introducing a formable material into the back-fill wafer via the plurality of channels such that the formable material at least partially fills the plurality of cavities;
• curing the formable material such that the formable material within the plurality of cavities is substantially solid;
• and
• dicing the wafer assembly into the plurality of discrete optoelectronic modules.