# US 11,114,581 B2 · Method for producing solar cell module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,581 B2 - Document ID: US11114581B2 - Status: Granted - Kind: B2 - Application number: 15/525,532 - Filed: 2015-11-05 - Published: 2020-08-06 - Granted: 2021-09-07 - Earliest claimed: 2014-11-19 - Assignees: Sharesun Co., Ltd. - Applicants: Sharesun Co., Ltd - Inventors: Jingjia Ji; Fan Zhu; Yusen Qin - Web page: https://patentgrep.com/patent/US11114581B2 ## CPC - H10F 71/137: {Batch treatment of the devices} - B23K 1/0016: {Soldering of electronic components} - B23K 1/002: Soldering by means of induction heating - B23K 1/0053: {soldering by means of infrared [IR]} - H10F 19/00: Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules - H10F 19/90: Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers (between thin-film photovoltaic cells on a single substrate H10F19/35) - H10F 71/00: Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) - B23K 2101/40: Semiconductor devices - Y02E 10/50: Photovoltaic [PV] energy - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract The present invention provides a method for producing a solar cell module; the present invention is characterized in that: in the process of soldering and connecting crystalline silicon solar cells, the crystalline silicon solar cells are kept still at positions on a bottom layer, and soldering and connecting of all crystalline silicon solar cells are implemented by moving a soldering apparatus or by moving the bottom layer; by means of the method for soldering and connecting crystalline silicon solar cells in the present invention, the process of soldering and connecting crystalline silicon solar cells is simplified and accelerated, and meanwhile, problems such as hidden fractures and power attenuation of the module occurring in the process of soldering and connecting solar cells are resolved. ## Claims ### Claim 1 A method for producing a crystalline silicon solar cell module, wherein crystalline silicon solar cells required by a crystalline silicon solar cell module and corresponding connecting strips are first positioned according to design arrangement of the crystalline silicon solar cell module, and subsequently the crystalline silicon solar cells are soldered and connected via a non-contact soldering and connecting method, comprising the steps of: (1) positioning the crystalline silicon solar cells and the corresponding connecting strips on a bottom layer; (2) placing a top layer on the crystalline silicon solar cells and the corresponding connecting strips; (3) utilizing weight of the top layer or external pressure to enable the connecting strips to be attached to metal grid lines of the crystalline silicon solar cells; and (4) soldering and connecting all of the crystalline silicon solar cells via a non-contact soldering and connecting method. ### Claim 2 (depends on 1) The method for producing a crystalline silicon solar cell module of claim 1, wherein all of the crystalline silicon solar cells required by a crystalline silicon solar cell module and the corresponding connecting strips are positioned at once. ### Claim 3 (depends on 1) The method for producing a crystalline silicon solar cell module of claim 1, wherein the bottom layer and the top layer are respectively composed of at least one layer of material. ### Claim 4 (depends on 3) The method for producing a crystalline silicon solar cell module of claim 3, wherein the bottom layer and the top layer are respectively composed of a layer of rigid material and a layer of flexible material. ### Claim 5 (depends on 4) The method for producing a crystalline silicon solar cell module of claim 4, wherein the rigid material is glass, and the flexible material is an encapsulating material of the crystalline silicon solar cell module. ### Claim 6 (depends on 1) The method for producing a crystalline silicon solar cell module of claim 1, wherein the connecting strips are attached to the metal grid lines of the crystalline silicon solar cells through weight of the top layer or external pressure. ### Claim 7 (depends on 1) The method for producing a crystalline silicon solar cell module of claim 1, wherein a contact-type external pressure is imposed onto the top layer, or a contact-type external pressure is simultaneously imposed onto the bottom layer and the top layer, thereby enabling the connecting strips to be attached to the metal grid lines of the crystalline silicon solar cells. ### Claim 8 (depends on 1) The method for producing a crystalline silicon solar cell module of claim 1, wherein a space between the bottom layer and the top layer is vacuumed, thereby enabling the connecting strips to be attached to the metal grid lines of the solar cells through pressure difference between internal pressure of the bottom layer and the top layer and the external pressure of the bottom layer and the top layer. ### Claim 9 (depends on 1) The method for producing a crystalline silicon solar cell module of claim 1, wherein the non-contact soldering method is an infrared heating soldering method, or a microwave heating soldering method, or an electro-magnetic induction heating soldering method. ### Claim 10 (depends on 1) The method for producing a crystalline silicon solar cell module of claim 1, wherein the non-contact soldering method is to solder and connect of all of the crystalline silicon solar cells by moving the non-contact soldering apparatus, or by simultaneously moving the bottom layer and the top layer while keeping the positions of the crystalline silicon solar cells unmoved relative to the bottom layer and the top layer. ### Claim 11 (depends on 2) The method for producing a crystalline silicon solar cell module of claim 2, wherein the bottom layer and the top layer are respectively composed of at least one layer of material. ### Claim 12 (depends on 6) The method for producing a crystalline silicon solar cell module of claim 6, wherein a contact-type external pressure is imposed onto the top layer, or a contact-type external pressure is simultaneously imposed onto the bottom layer and the top layer, thereby enabling the connecting strips to be tightly attached to the metal grid lines of the crystalline silicon solar cells. ### Claim 13 (depends on 6) The method for producing a crystalline silicon solar cell module of claim 6, wherein a space between the bottom layer and the top layer is vacuumed, thereby enabling the connecting strips to be attached to the metal grid lines of the solar cells through pressure difference between internal pressure of the bottom layer and the top layer and the external pressure of the bottom layer and the top layer. ### Claim 14 (depends on 9) The method for producing a crystalline silicon solar cell module of claim 9, wherein the non-contact soldering method is to solder and connect of all of the crystalline silicon solar cells by moving the non-contact soldering apparatus, or by simultaneously moving the bottom layer and the top layer while keeping the positions of the crystalline silicon solar cells unmoved relative to the bottom layer and the top layer.