# US 11,114,573 B2 · Optoelectronic module assembly and manufacturing method

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- Number: US 11,114,573 B2
- Document ID: US11114573B2
- Status: Granted
- Kind: B2
- Application number: 16/719,194
- Filed: 2019-12-18
- Published: 2020-04-23
- Granted: 2021-09-07
- Earliest claimed: 2016-03-23
- Assignees: ams Sensors Singapore Pte. Ltd.
- Applicants: ams Sensors Singapore Pte. Ltd.
- Inventors: Martin Lukas Balimann; Matthias Gloor; Philippe Bouchilloux; Jukka Alasirnio; Hartmut Rudmann; Nicola Spring
- Web page: https://patentgrep.com/patent/US11114573B2

## CPC

- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H01S 5/02208: characterised by the shape of the housings
- H01S 5/02253: using lenses
- H01S 5/023: Mount members, e.g. sub-mount members
- H01S 5/0233: Mounting configuration of laser chips
- H01S 5/0235: Method for mounting laser chips
- H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
- H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting}
- H10F 39/804: {Containers or encapsulations}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 39/811: {Interconnections}
- H10F 77/407: {indirectly associated with the devices}
- H10F 77/413: {directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42)}
- H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H10F 77/933: {for devices having potential barriers}
- H10F 77/953: {for devices having potential barriers}
- H10H 20/8506: {Containers}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8585: {being an interconnection}
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2201/10121: Optical component, e.g. opto-electronic component
- H05K 2203/049: Wire bonding
- H10F 39/024: {of coatings or optical elements}
- H10H 20/036: {of packages}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- H10H 20/0365: {of means for heat extraction or cooling}
- H10H 20/85: Packages
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

## Claims

### Claim 1

An optoelectronic module comprising:
an active optoelectronic component in or on a mounting substrate, the mounting substrate having a first surface and having a second surface on an opposite side from the first surface;
an optical sub-assembly;
a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly;
first electrical contacts disposed on the first surface of the mounting substrate; and
second electrical contacts disposed on the second surface of the mounting substrate;
wherein the first and second electrical contacts are configured to permit active alignment of the active optoelectronic component and the optical sub-assembly.

### Claim 2 (depends on 1)

The optoelectronic module of claim 1, wherein the spacer comprises electrically insulating protrusions that project beyond the second surface of the mounting substrate in a direction away from the optical sub-assembly.

### Claim 3 (depends on 1)

The optoelectronic module of claim 1 wherein the mounting substrate comprises a lead frame, printed circuit board or ceramic board having conductive wiring.