# US 11,114,519 B2 · Organic light emitting display device and method of manufacturing the same

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- Number: US 11,114,519 B2
- Document ID: US11114519B2
- Status: Granted
- Kind: B2
- Application number: 16/020,991
- Filed: 2018-06-27
- Published: 2018-11-08
- Granted: 2021-09-07
- Earliest claimed: 2014-12-29
- Assignees: LG Display Co., Ltd.
- Applicants: LG Display Co., Ltd.
- Inventors: Min-Joo Kim; Jung-Sun Beak; Jin-Hee Jang; Nam-Yong Kim
- Web page: https://patentgrep.com/patent/US11114519B2

## CPC

- H10K 59/123: Connection of the pixel electrodes to the thin film transistors [TFT]
- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- H10K 59/1315: {comprising structures specially adapted for lowering the resistance}
- H10K 59/80522: {combined with auxiliary electrodes}
- H10K 59/1201: {Manufacture or treatment}
- H10K 59/122: Pixel-defining structures or layers, e.g. banks
- H10K 59/873: {Encapsulations}
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

An organic light emitting display device and a method of manufacturing the same are provided that may reduce the resistance of a second electrode and may prevent corrosion and metal migration of a pad electrode without adding a separate mask process, or while reducing the number of mask processes. In the organic light emitting display device, an auxiliary line is connected to a second electrode through an auxiliary electrode, which is provided in the same layer as a first electrode, and a pad cover electrode is configured to cover an upper surface and a side surface of a pad connection electrode so as to prevent the pad connection electrode connected to a pad from being exposed outward.

## Claims

### Claim 1

An organic light-emitting display device comprising:
an organic emission layer disposed on a substrate;
an upper electrode disposed on the organic emission layer;
first and second lower electrodes disposed below the upper electrode, wherein the first lower electrode is connected to a thin-film transistor disposed on the substrate;
a plurality of lower insulation layers disposed between each of the first and second lower electrodes and the substrate;
an auxiliary line connected to the second lower electrode and disposed below the second lower electrode;
an auxiliary cover line disposed to cover an upper surface and a side surface of the auxiliary line;
a connection line configured to interconnect the thin-film transistor and the first lower electrode and disposed in the same layer as the auxiliary line; and
a connection cover line disposed on the connection line to cover an upper surface and a side surface of the connection line and spaced apart from the auxiliary cover line with a trench interposed therebetween,
wherein, at a location between the first and second lower electrodes in a plan view, adjacent ones of the plurality of lower insulation layers each have a side surface such that the side surface of each of the adjacent ones of the plurality of lower insulation layers face each other, and
wherein any one of the plurality of lower insulating layers is disposed on the auxiliary cover line to expose a side surface of the auxiliary cover line.

### Claim 2 (depends on 1)

The device according to claim 1, wherein each of the first and second lower electrodes are formed of at least two layers including a transparent conductive material layer and a metal material layer.

### Claim 3 (depends on 1)

The device according to claim 1, further comprising an upper insulation layer configured to be in contact with the side surfaces of the adjacent ones of the plurality of lower insulation layers.

### Claim 4 (depends on 1)

The device according to claim 1, further comprising an upper insulation layer configured to be in contact with the side surfaces of the adjacent ones of the plurality of lower insulation layers, the upper insulation layer being disposed on a portion of an upper surface and a side surface of each of the first and second lower electrodes.

### Claim 5 (depends on 2)

The device according to claim 2, further comprising a plurality of upper insulation layers disposed on opposite side surfaces of each of the first and second lower electrodes,
wherein the upper insulation layers disposed between the first and second lower electrodes are spaced apart from each other.

### Claim 6 (depends on 1)

The device according to claim 1, wherein the second lower electrode is an auxiliary electrode that is disposed in the same layer as the first lower electrode and is connected to the upper electrode.

### Claim 7 (depends on 6)

The device according to claim 6, wherein the plurality of lower insulation layers comprises:
a first protective layer disposed between the first lower electrode and the connection line; and
a second protective layer disposed between the auxiliary electrode and the auxiliary line, and
wherein side surfaces of the first and second protective layers exposed between the first lower electrode and the auxiliary electrode face each other.

### Claim 8 (depends on 7)

The device according to claim 7, further comprising an upper insulation layer disposed between the first and second protective layers that face each other.

### Claim 9

An organic light-emitting display device comprising:
an organic emission layer disposed on a substrate;
an upper electrode disposed on the organic emission layer;
a plurality of lower electrodes disposed below the upper electrode;
a plurality of lower insulation layers disposed between the plurality of lower electrodes and the substrate;
a trench located between the plurality of lower electrodes, in a plan view, in a lower insulation layer among the plurality of lower insulation layers;
an auxiliary line connected to one lower electrode of the plurality of lower electrodes and disposed below the one lower electrode;
an auxiliary cover line disposed to cover an upper surface and a side surface of the auxiliary line;
a connection line configured to interconnect other lower electrode of the plurality of lower electrodes and a thin-film transistor and disposed in the same layer as the auxiliary line; and
a connection cover line disposed on the connection line to cover an upper surface and a side surface of the connection line and spaced apart from the auxiliary cover line with the trench interposed therebetween,
wherein any one of the plurality of lower insulating layers is disposed on the auxiliary cover line to expose a side surface of the auxiliary cover line.

### Claim 10 (depends on 9)

The device according to claim 9, wherein the plurality of lower electrodes comprises:
a first lower electrode being the other lower electrode of the plurality of lower electrodes and connected to the thin-film transistor; and
a second lower electrode being the one lower electrode of the plurality of lower electrodes and disposed in the same layer as the first lower electrode.

### Claim 11 (depends on 10)

The device according to claim 10, wherein each of the first and second lower electrodes are formed of at least two layers including a transparent conductive material layer and a metal material layer.

### Claim 12 (depends on 10)

The device according to claim 10, further comprising an upper insulation layer disposed in the trench.

### Claim 13 (depends on 10)

The device according to claim 10, further comprising an upper insulation layer configured to be in contact with a side surface of the trench.

### Claim 14 (depends on 13)

The device according to claim 13, wherein the upper insulation layer is disposed on a portion of an upper surface and a side surface of the first and second lower electrodes.

### Claim 15 (depends on 10)

The device according to claim 10, further comprising a plurality of upper insulation layers disposed on opposite side surfaces of each of the first and second lower electrodes,
wherein the upper insulation layers disposed between the first and second lower electrodes are spaced apart from each other.

### Claim 16 (depends on 9)

The device according to claim 9, wherein the trench is directed from an upper surface of the lower insulation layer towards the substrate.

### Claim 17 (depends on 12)

The device according to claim 12, wherein the first lower electrode faces the upper electrode with the organic emission layer interposed therebetween, and
wherein the second lower electrode is an auxiliary electrode that is connected to the upper electrode.

### Claim 18 (depends on 17)

The device according to claim 17, wherein the plurality of lower insulation layers comprises:
a first protective layer disposed between the first lower electrode and the connection line; and
a second protective layer disposed between the auxiliary electrode and the auxiliary line, and
wherein side surfaces of the first and second protective layers face each other with the upper insulation layer, disposed in the trench, interposed therebetween.
