Array substrate and method for manufacturing an array sunstrate

An array substrate, comprising:

• a substrate;
• a switch assembly disposed on the substrate;
• a plurality of photosensors;
• a color photoresist layer;
• and
• a pixel electrode formed on the color photoresist layer and coupled with the switch assembly;
• wherein the photosensor is correspondingly disposed on a side of the switch assembly;
• the color photoresist layer is formed on the switch assembly and the photosensor;
• the switch assembly comprising a first metal layer;
• the photosensor comprises a first electrode layer formed directly on the substrate and a first amorphous silicon layer disposed above the first electrode;
• the first electrode layer and the first metal layer are disposed on a same layer;
• wherein the first metal layer and the first electrode layer are made of a same metal material;
• a second electrode layer corresponding to the first electrode layer is disposed above the photosensor;
• wherein the photosensor further comprises a P-type amorphous silicon layer, the first amorphous silicon layer, and a first doped layer;
• the P-type amorphous silicon layer, the first amorphous silicon layer, and the first doped layer are sequentially disposed above the first electrode layer;
• wherein the switching assembly comprises the first metal layer, an insulating layer, a second amorphous silicon layer, and a second doped layer in order on the substrate;
• a source electrode metal layer and a drain electrode metal layer are relatively disposed on the second doped layer;
• the first amorphous silicon layer and the second amorphous silicon layer are disposed on a same layer;
• the first doped layer and the second doped layer are disposed on a same layer;
• outer layers of the switch assembly comprises a passivation layer, the first amorphous silicon layer and the second amorphous silicon layer are separated by the passivation layer, the first doped layer and the second doped layer are separated by the passivation layer;
• wherein the photosensor is disposed between two adjacent switch assemblies;
• wherein the color photoresist layer is formed on the passivation layer;
• the color photoresist layer is formed on the second electrode layer;
• wherein the color photoresist layer comprises a red color resist, a green color resist, and a blue color resist;
• wherein the pixel electrode is formed on the color photoresist layer.

A method for manufacturing an array substrate, comprising:

• providing a substrate;
• forming a first metal layer and a first electrode layer disposed on a same layer of the first metal layer on the substrate;
• forming a switch assembly on the first metal layer;
• forming a plurality of photosensors comprising a first amorphous silicon layer above the first electrode layer;
• forming a color photoresist layer above the switch assembly and the photosensor;
• and
• forming a pixel electrode on the color photoresist layer.