# US 11,114,442 B2 · Semiconductor memory device with shallow buried capacitor and fabrication method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,442 B2 - Document ID: US11114442B2 - Status: Granted - Kind: B2 - Application number: 16/711,439 - Filed: 2019-12-12 - Published: 2021-06-17 - Granted: 2021-09-07 - Earliest claimed: 2019-12-12 - Assignees: HeFeChip Corporation Limited - Applicants: HeFeChip Corporation Limited - Inventors: Geeng-Chuan Chern; Liang-Choo Hsia - Web page: https://patentgrep.com/patent/US11114442B2 ## CPC - H10B 12/373: {the capacitor extending under or around the transistor} - H10D 1/665: {Trench conductor-insulator-semiconductor capacitors, e.g. trench MOS capacitors} - H10B 12/0387: {Making the trench} - H10B 12/05: {Making the transistor} - H10B: ELECTRONIC MEMORY DEVICES - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A semiconductor device includes a bottle-shaped capacitor cavity extends through a silicon device layer and a buried oxide layer of a substrate. The bottle-shaped capacitor cavity includes an upper portion in the silicon device layer and a widened bottom burrow in the buried oxide layer and underneath the silicon device layer. The widened bottom burrow is wider than the upper portion. A buried capacitor is disposed in the bottle-shaped capacitor cavity. The buried capacitor includes an inner electrode and an outer electrode with the capacitor dielectric layer therebetween. A transistor is disposed on the substrate. The transistor includes a source region and a drain region, a channel region between the source region and the drain region, and a gate over the channel region. The source region is electrically connected to the inner electrode. ## Claims ### Claim 1 A semiconductor device, comprising: a substrate comprising a semiconductor substrate, a buried oxide layer on said semiconductor substrate, and a silicon device layer on said buried layer; at least one bottle-shaped capacitor cavity extending through said silicon device layer and said buried oxide layer, wherein said at least one bottle-shaped capacitor cavity is comprised of an upper portion disposed in said silicon device layer and a widened bottom burrow disposed in said buried oxide layer and underneath the silicon device layer, wherein said widened bottom burrow is wider than said upper portion; at least one buried capacitor located in said at least one bottle-shaped capacitor cavity, said at least one buried capacitor comprising an inner electrode and an outer electrode with a capacitor dielectric layer therebetween; at least one transistor disposed on said substrate, wherein said at least one transistor comprises a source region and a drain region disposed in said silicon device layer, a channel region between said source region and said drain region, and a gate over said channel region, and wherein said source region is electrically connected to said inner electrode of said at least one buried capacitor; and a conductive material layer embedded within said upper portion, wherein said inner electrode is in direct contact with said conductive material layer. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein said outer electrode protrudes beyond a sidewall surface of said upper portion. ### Claim 3 (depends on 1) The semiconductor device according to claim 1, wherein said outer electrode comprises an N-type polysilicon with rugged surface. ### Claim 4 (depends on 1) The semiconductor device according to claim 1, wherein said widened bottom burrow is completely filled with said outer electrode, said capacitor dielectric layer and said inner electrode. ### Claim 5 (depends on 1) The semiconductor device according to claim 1, wherein said source region is electrically connected to the conductive material layer. ### Claim 6 (depends on 1) The semiconductor device according to claim 1 further comprising: a silicide layer on said source region, said drain region, said gate and said conductive material layer. ### Claim 7 (depends on 1) The semiconductor device according to claim 1, wherein a lower surface of said silicon device layer, a side surface of said buried oxide layer and an upper surface of said semiconductor substrate constitute an interior surface of said widened bottom burrow. ### Claim 8 (depends on 7) The semiconductor device according to claim 7, wherein said outer electrode conformally covers said lower surface of said silicon device layer, said side surface of said buried oxide layer and said upper surface of said semiconductor substrate within said widened bottom burrow. ### Claim 9 (depends on 8) The semiconductor device according to claim 8, wherein an oxide layer is disposed on said lower surface of said silicon device layer and said upper surface of said semiconductor substrate within said widened bottom burrow. ### Claim 10 (depends on 9) The semiconductor device according to claim 9, wherein said oxide layer has a thickness of about 2-8 nm. ### Claim 11 (depends on 9) The semiconductor device according to claim 9, wherein said outer electrode is in direct contact with said oxide layer within said widened bottom burrow. ### Claim 12 (depends on 7) The semiconductor device according to claim 7 further comprising: an N+ doped region disposed in said upper surface of said semiconductor substrate within said widened bottom burrow. ### Claim 13 (depends on 12) The semiconductor device according to claim 12, wherein said outer electrode is in direct contact with said N+ doped region within said widened bottom burrow. ### Claim 14 A method for forming a semiconductor device, comprising: providing a substrate comprising a semiconductor substrate, a buried oxide layer on said semiconductor substrate, and a silicon device layer on said buried layer; forming at least one bottle-shaped capacitor cavity extending through said silicon device layer and said buried oxide layer, wherein said at least one bottle-shaped capacitor cavity is comprised of an upper portion disposed in said silicon device layer and a widened bottom burrow disposed in said buried oxide layer and underneath the silicon device layer, wherein said widened bottom burrow is wider than said upper portion; forming at least one buried capacitor in said at least one bottle-shaped capacitor cavity, said at least one buried capacitor comprising an inner electrode and an outer electrode with a capacitor dielectric layer therebetween; forming a conductive material layer embedded within said upper portion, wherein said inner electrode is in direct contact with said conductive material layer; and forming at least one transistor on said substrate, wherein said at least one transistor comprises a source region and a drain region disposed in said silicon device layer, a channel region between said source region and said drain region, and a gate over said channel region, and wherein said source region is electrically connected to said inner electrode of said at least one buried capacitor. ### Claim 15 (depends on 14) The method according to claim 14, wherein said outer electrode protrudes beyond a sidewall surface of said upper portion. ### Claim 16 (depends on 14) The method according to claim 14, wherein said outer electrode comprises an N-type polysilicon with rugged surface. ### Claim 17 (depends on 14) The method according to claim 14, wherein said widened bottom burrow is completely filled with said outer electrode, said capacitor dielectric layer and said inner electrode. ### Claim 18 (depends on 14) The method according to claim 14, wherein said source region is electrically connected to the conductive material layer. ### Claim 19 (depends on 14) The method according to claim 14 further comprising: forming a silicide layer on said source region, said drain region, said gate and said conductive material layer. ### Claim 20 (depends on 14) The method according to claim 14, wherein a lower surface of said silicon device layer, a side surface of said buried oxide layer and an upper surface of said semiconductor substrate constitute an interior surface of said widened bottom burrow. ### Claim 21 (depends on 20) The method according to claim 20, wherein said outer electrode conformally covers said lower surface of said silicon device layer, said side surface of said buried oxide layer and said upper surface of said semiconductor substrate within said widened bottom burrow. ### Claim 22 (depends on 21) The method according to claim 21 further comprising: forming an oxide layer on said lower surface of said silicon device layer and said upper surface of said semiconductor substrate within said widened bottom burrow. ### Claim 23 (depends on 22) The method according to claim 22, wherein said oxide layer has a thickness of about 2-8 nm. ### Claim 24 (depends on 22) The method according to claim 22, wherein said outer electrode is in direct contact with said oxide layer within said widened bottom burrow. ### Claim 25 (depends on 20) The method according to claim 20 further comprising: forming an N+ doped region in said upper surface of said semiconductor substrate within said widened bottom burrow. ### Claim 26 (depends on 25) The method according to claim 25, wherein said outer electrode is in direct contact with said N+ doped region within said widened bottom burrow.