# US 11,114,426 B2 · Bendable panel and method of fabricating same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,426 B2 - Document ID: US11114426B2 - Status: Granted - Kind: B2 - Application number: 16/349,283 - Filed: 2019-04-02 - Published: 2021-06-17 - Granted: 2021-09-07 - Earliest claimed: 2018-12-03 - Applicants: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Inventors: Mingliang Wang - Web page: https://patentgrep.com/patent/US11114426B2 ## CPC - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 1/0281: {Reinforcement details thereof} - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 59/873: {Encapsulations} - H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass - H10K 77/111: {Flexible substrates} - H10W 90/00: Package configurations - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 2201/0154: Polyimide - H05K 2201/057: Shape retainable - H05K 2201/10128: Display - H10K 2102/311: {Flexible OLED} - Y02E 10/549: Organic PV cells - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A bendable panel and a method of fabricating same are provided. The bendable panel improves a current display panel to provide better support and impact resistance to a bent region of a display panel. In addition, a protection performance, such as corrosion resistance, on a line in the bent region is improved. ## Claims ### Claim 1 A bendable panel, comprising: a flexible display panel comprising a flexible substrate as a base, wherein the flexible substrate comprises an active display area and a binding end positioned on a side of the active display area; a driving chip disposed on the binding end, wherein the binding end is bent toward a direction away from a light emitting side of the flexible display panel, such that the driving chip is positioned on a back surface of the flexible substrate; a back film layer disposed on the back surface of the flexible substrate, wherein the back film layer is configured to support and protect the flexible substrate; a foam layer disposed on the back surface of the back film layer, wherein the foam layer is configured to protect the flexible substrate; and a support plate; wherein the binding end comprises a first terminal portion adjacent to the active display area, a second terminal portion adjacent to the driving chip, and a bent portion connected to the first terminal portion and the second terminal portion and having a bent shape; and wherein a bent region disposed on an inner surface of the bent portion is provided with a glue; wherein the support plate is attached to a back surface of the second terminal portion, the support plate covers at least the back surface of the second terminal portion on which the driving chip is disposed, a configuration of the support plate, the back surface of the second terminal portion, and the driving chip fills a height difference between the foam layer and the second terminal portion. ### Claim 2 (depends on 1) The bendable panel according to claim 1, further comprising a film circuit layer disposed on the flexible substrate and connected between the active display area and the driving chip, and the film circuit layer is attached to the bent portion and bent in a same direction as the bent portion. ### Claim 3 (depends on 2) The bendable panel according to claim 2, further comprising a conductive line disposed on a surface of the film circuit layer and connected to the flexible display panel and the driving chip. ### Claim 4 (depends on 2) The bendable panel according to claim 2, further comprising an ultraviolet glue layer disposed on an outer surface of the film circuit layer. ### Claim 5 (depends on 1) The bendable panel according to claim 1, wherein the driving chip is directly attached to the flexible substrate. ### Claim 6 (depends on 1) The bendable panel according to claim 1, wherein the driving chip is indirectly secured to the flexible substrate by a flip chip. ### Claim 7 A method of fabricating a bendable panel, wherein the bendable panel comprises: a flexible display panel comprising a flexible substrate as a base, wherein the flexible substrate comprises an active display area and a binding end positioned on a side of the active display area; a driving chip disposed on the binding end, wherein the binding end is bent toward a direction away from a light emitting side of the flexible display panel, such that the driving chip is positioned on a back surface of the flexible substrate; a back film layer disposed on the back surface of the flexible substrate, wherein the back film layer is configured to support and protect the flexible substrate; a foam layer disposed on the back surface of the back film layer, wherein the foam layer is configured to protect the flexible substrate; and a support plate; wherein the binding end comprises a first terminal portion adjacent to the active display area, a second terminal portion adjacent to the driving chip, and a bent portion connected to the first terminal portion and the second terminal portion and having a bent shape; and wherein a bent region disposed on an inner surface of the bent portion is provided with a glue; wherein the support plate is attached to a back surface of the second terminal portion, the support plate covers at least the back surface of the second terminal portion on which the driving chip is disposed, a configuration of the support plate, the back surface of the second terminal portion, and the driving chip fills a height difference between the foam layer and the second terminal portion; wherein the method comprises: (a) binding the driving chip to the binding end of the flexible substrate; (b) providing the glue on the surface of the binding end facing away from the light emitting side of the flexible substrate; (c) after the glue is applied to the binding end, bending the binding end facing away from the light emitting side of the flexible display panel, such that the driving chip is disposed on the back surface of the flexible substrate; and curing the glue. ### Claim 8 (depends on 7) The method according to claim 7, wherein in step (b), the glue is provided by spraying or coating. ### Claim 9 (depends on 7) The method according to claim 7, wherein in step (d), the glue is cured by high temperature or standing.