# US 11,114,425 B2 · Packaging of radiation detectors in an image sensor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,425 B2 - Document ID: US11114425B2 - Status: Granted - Kind: B2 - Application number: 16/919,511 - Filed: 2020-07-02 - Published: 2020-10-22 - Granted: 2021-09-07 - Earliest claimed: 2018-01-24 - Assignees: Shenzhen Xpectvision Technology Co., Ltd. - Applicants: Shenzhen Xpectvision Technology Co., Ltd. - Inventors: Peiyan Cao; Yurun Liu; Chongshen Song - Web page: https://patentgrep.com/patent/US11114425B2 ## CPC - H10F 39/1898: {Indirect radiation image sensors, e.g. using luminescent members} - H10W 90/00: Package configurations - A61B 6/4007: {characterised by using a plurality of source units} - A61B 6/51: for dentistry - G01N 23/046: using tomography, e.g. computed tomography [CT] - G01N 23/10: the material being confined in a container, e.g. in a luggage X-ray scanners - G01N 23/18: Investigating the presence of flaws defects or foreign matter - G01N 23/203: Measuring back scattering - G01T 1/24: with semiconductor detectors - G01T 1/243: {Modular detectors, e.g. arrays formed from self contained units (constructional or manufacturing details H10W90/00)} - H01R 12/52: connecting to other rigid printed circuits or like structures - H01R 12/716: {Coupling device provided on the PCB} - H01R 12/718: {Contact members provided on the PCB without an insulating housing (contacts for abutting H01R12/714)} - H10F 39/1895: {of the hybrid type} - A61B 6/502: {for diagnosis of breast, i.e. mammography} - G01N 23/20091: Measuring the energy-dispersion spectrum [EDS] of diffracted radiation - G01N 23/2252: Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA] - G01N 2223/629: welds, bonds, sealing compounds - G01N 2223/646: flaws, defects - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - G01T: MEASUREMENT OF NUCLEAR OR X-RADIATION (radiation analysis of materials, mass spectrometry G01N23/00; tubes for determining the presence, intensity, density or energy of radiation or particles H01J47/00) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract Disclosed herein is an image sensor comprising: a first package comprising a plurality of radiation detectors mounted on a printed circuit board (PCB); wherein a dead zone of the first package does not extend between neighboring radiation detectors among the plurality of radiation detectors; wherein the radiation detectors have no guard rings or sidewall doping. ## Claims ### Claim 1 An image sensor comprising: a first package comprising a plurality of radiation detectors mounted on a printed circuit board (PCB); wherein a dead zone of the first package does not extend between neighboring radiation detectors among the plurality of radiation detectors; wherein the radiation detectors have no guard rings or sidewall doping; wherein each of the radiation detectors comprises an array of pixels; wherein pixels on peripheries of the radiation detectors are configured to deduct a contribution of a dark current from energy of a radiation particle incident thereon. ### Claim 2 (depends on 1) The image sensor of claim 1, wherein the first package is mounted on a system PCB by a plug and a receptacle. ### Claim 3 (depends on 2) The image sensor of claim 2, wherein the first package is tilted relative to the system PCB. ### Claim 4 (depends on 1) The image sensor of claim 1, wherein the first package is mounted on a system PCB by wire bonding. ### Claim 5 (depends on 1) The image sensor of claim 1, further comprising a second package, wherein the dead zone of the first package is shadowed by the second package. ### Claim 6 (depends on 5) The image sensor of claim 5, wherein the dead zone of the first package is shadowed by an active area of the second package. ### Claim 7 (depends on 1) The image sensor of claim 1, wherein the first package is rectangular in shape. ### Claim 8 (depends on 1) The image sensor of claim 1, wherein the first package is hexagonal in shape. ### Claim 9 (depends on 1) The image sensor of claim 1, wherein a gap between two neighboring radiation detectors is not wider than a pixel of the two neighboring radiation detectors. ### Claim 10 (depends on 1) The image sensor of claim 1, wherein at least one radiation detector of the radiation detectors does not comprise a perimeter zone along at least three sides of the at least one radiation detector. ### Claim 11 (depends on 1) The image sensor of claim 1, wherein at least one of the radiation detectors comprises a radiation absorption layer and an electronics layer; wherein the radiation absorption layer comprises an electrode; wherein the electronics layer comprises an electronics system; wherein the electronics system comprises: a first voltage comparator configured to compare a voltage of the electrode to a first threshold; a second voltage comparator configured to compare the voltage to a second threshold; a counter configured to register a number of radiation particles reaching the radiation absorption layer; a controller; wherein the controller is configured to start a time delay from a time at which the first voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the first threshold; wherein the controller is configured to activate the second voltage comparator during the time delay; wherein the controller is configured to cause the number registered by the counter to increase by one, when the second voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the second threshold. ### Claim 12 (depends on 11) The image sensor of claim 11, wherein the electronics system further comprises a capacitor module electrically connected to the electrode, wherein the capacitor module is configured to collect charge carriers from the electrode. ### Claim 13 (depends on 11) The image sensor of claim 11, wherein the controller is configured to activate the second voltage comparator at a beginning or expiration of the time delay. ### Claim 14 (depends on 11) The image sensor of claim 11, wherein the electronics system further comprises a voltmeter, wherein the controller is configured to cause the voltmeter to measure the voltage upon expiration of the time delay. ### Claim 15 (depends on 11) The image sensor of claim 11, wherein the controller is configured to determine a radiation particle energy based on a value of the voltage measured upon expiration of the time delay. ### Claim 16 (depends on 11) The image sensor of claim 11, wherein the controller is configured to connect the electrode to an electrical ground. ### Claim 17 (depends on 11) The image sensor of claim 11, wherein a rate of change of the voltage is substantially zero at expiration of the time delay. ### Claim 18 (depends on 11) The image sensor of claim 11, wherein a rate of change of the voltage is substantially non-zero at expiration of the time delay. ### Claim 19 (depends on 1) A system comprising the image sensor of claim 1 and a radiation source, wherein the system is configured to perform radiography on human chest or abdomen. ### Claim 20 (depends on 1) A system comprising the image sensor of claim 1 and a radiation source, wherein the system is configured to perform radiography on human mouth. ### Claim 21 (depends on 1) A cargo scanning or non-intrusive inspection (NII) system, comprising the image sensor of claim 1 and a radiation source, wherein the cargo scanning or non-intrusive inspection (NII) system is configured to form an image using backscattered radiation. ### Claim 22 (depends on 1) A cargo scanning or non-intrusive inspection (NII) system, comprising the image sensor of claim 1 and a radiation source, wherein the cargo scanning or non-intrusive inspection (NII) system is configured to form an image using radiation transmitted through an object inspected. ### Claim 23 (depends on 1) A full-body scanner system comprising the image sensor of claim 1 and a radiation source. ### Claim 24 (depends on 1) A radiation computed tomography (Radiation CT) system comprising the image sensor of claim 1 and a radiation source. ### Claim 25 (depends on 1) An electron microscope comprising the image sensor of claim 1, an electron source and an electronic optical system. ### Claim 26 (depends on 1) A system comprising the image sensor of claim 1, wherein the system is a radiation telescope, or a radiation microscopy, or wherein the system is configured to perform mammography, industrial defect detection, microradiography, casting inspection, weld inspection, or digital subtraction angiography.