# US 11,114,423 B2 · Image-forming element

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- Number: US 11,114,423 B2
- Document ID: US11114423B2
- Status: Granted
- Kind: B2
- Application number: 15/776,216
- Filed: 2016-11-09
- Published: 2018-12-13
- Granted: 2021-09-07
- Earliest claimed: 2015-12-01
- Assignees: Sharp Kabushiki Kaisha
- Applicants: Sharp Kabushiki Kaisha
- Inventors: Katsuji Iguchi
- Web page: https://patentgrep.com/patent/US11114423B2

## CPC

- H10W 90/00: Package configurations
- G09F 9/33: being semiconductor devices, e.g. diodes
- G09G 3/32: semiconductive, e.g. using light-emitting diodes [LED]
- G09G 3/3233: with pixel circuitry controlling the current through the light-emitting element
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- G09G 3/006: {Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays (testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309)}
- G09G 2300/0426: Layout of electrodes and connections
- G09G 2300/0814: used for selection purposes, e.g. logical AND for partial update
- G09G 2300/0842: forming a memory circuit, e.g. a dynamic memory with one capacitor
- G09G 2330/12: Test circuits or failure detection circuits included in a display system, as permanent part thereof
- H10H 20/01: Manufacture or treatment
- H10H 20/01335: {the light-emitting regions comprising nitride materials}
- H10H 20/018: {Bonding of wafers}
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0364: {of interconnections}
- H10H 20/819: characterised by their shape, e.g. curved or truncated substrates
- H10H 20/833: Transparent materials
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient}
- H10H 20/853: characterised by their shape
- H10H 20/856: Reflecting means
- H10H 20/882: {Scattering means (H10H20/82 takes precedence)}
- H10P 74/232: {comprising connection or disconnection of parts of a device in response to a measurement}
- H10W 72/0198: {batch processes}
- H10W 72/072: {of bump connectors}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

An image-forming element includes a plurality of pixels, and projects and displays light emitted from the pixels. The image-forming element includes a light emitting element which includes a light source emitting the light and a mounting substrate on which a plurality of light emitting elements are provided on a mounting surface. A plurality of light sources which are segmented and included in at least one pixel are provided, and each of the light sources includes power supply electrodes provided on the same surface or a surface facing the mounting substrate. The mounting substrate includes a drive circuit which drives the light source and electrodes which are provided on the mounting surface and are electrically connected to the power supply electrodes of the light source. In each pixel, an area occupation ratio of the light source with respect to a region area of the pixel is 15% or more and 85% or less. The drive circuit includes a switch circuit which selectively short-circuits the electrodes electrically connected to the power supply electrodes of the light source with other electrodes or wirings in the drive circuit, or at least one non-volatile memory transistor for adjusting a light emission intensity of the light emitting element.

## Claims

### Claim 1

An image-forming element that includes a plurality of pixels and projects and displays light emitted from the pixels, the element comprising:
a light emitting element which includes a light source emitting the light; and
a mounting substrate on which a plurality of light emitting elements are provided on a mounting surface,
wherein a plurality of light sources which are segmented and included in at least one pixel are provided,
wherein each of the light sources includes one or a plurality of power supply electrodes provided on the same surface,
wherein the mounting substrate includes a drive circuit which drives the light source and electrodes which are provided on the mounting surface and are electrically connected to the power supply electrodes of the light source, and
wherein the drive circuit includes at least one non-volatile memory transistor to reduce a variation of light emission intensity between the light emitting elements.

### Claim 2 (depends on 1)

The image-forming element according to claim 1,
wherein the mounting substrate is a semiconductor substrate, and
wherein the drive circuit, an array selection circuit which selects the pixels arranged in a predetermined direction, and a signal output circuit which outputs a drive signal to the drive circuit for driving the light source of the pixel selected by the array selection circuit are monolithically formed on the mounting substrate.

### Claim 3 (depends on 1)

The image-forming element according to claim 1, further comprising:
an anisotropic conductive film which is provided on an entire surface of the mounting substrate,
wherein the power supply electrodes of each of the light sources are provided on the electrodes of the mounting substrate via the same anisotropic conductive film.

### Claim 4 (depends on 1)

The image-forming element according to claim 1,
wherein the drive circuit includes a switch circuit which is disposed electrically in parallel with the light source and in serial with a drive transistor which controls current flow to the light source.

### Claim 5 (depends on 1)

The image-forming element according to claim 1, wherein
the drive circuit includes a driving transistor, and
the at least one non-volatile memory transistor is connected in series with the driving transistor and the light emitting element between the driving transistor and the light emitting element.

### Claim 6 (depends on 1)

The image-forming element according to claim 1,
wherein the plurality of light sources which are optically and mechanically segmented from each other.

### Claim 7 (depends on 1)

The image-forming element according to claim 1,
a threshold voltage of the at least one non-volatile memory transistor is increased to decrease light emission intensity of the light emitting element which exceeds an allowable range of the light emission intensity.