# US 11,114,411 B2 · Semiconductor chip transfer method and transfer tool

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- Number: US 11,114,411 B2
- Document ID: US11114411B2
- Status: Granted
- Kind: B2
- Application number: 16/345,449
- Filed: 2017-10-25
- Published: 2019-08-15
- Granted: 2021-09-07
- Earliest claimed: 2016-10-28
- Assignees: OSRAM OLED GmbH
- Applicants: OSRAM Opto Semiconductors GmbH
- Inventors: Thomas Schwarz; Jürgen Moosburger; Frank Singer
- Web page: https://patentgrep.com/patent/US11114411B2

## CPC

- B65G 47/90: Devices for picking-up and depositing articles or materials
- H10H 20/01: Manufacture or treatment
- H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 72/0198: {batch processes}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/073: {of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier

## Claims

### Claim 1

A method of transferring semiconductor chips comprising:
providing a transfer tool having a plurality of segments, each segment having a liquid receiving area;
providing a plurality of semiconductor chips in a regular array on a source carrier;
providing a target carrier;
selectively arranging liquid drops on the liquid receiving areas of some of the segments;
causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip;
lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool;
causing the transfer tool to approach the target carrier such that the semiconductor chips arranged on the transfer tool contact the target carrier; and
lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the arrangement of the liquid drops is carried out at least partially in parallel.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the arrangement of the liquid drops on the liquid receiving areas is carried out by shooting, or the selective arrangement of the liquid drops comprises:
selectively applying electrical charge to the liquid receiving areas of at least some of the segments; and
immersing the liquid receiving areas in a polar liquid.

### Claim 4 (depends on 3)

The method according to claim 3, wherein the selective application of electrical charge to the liquid receiving areas of at least some of the segments comprises:
applying electrical charge to the liquid receiving areas of all segments of the transfer tool; and
selectively removing the charge from some of the segments.

### Claim 5 (depends on 1)

The method according to claim 1, further comprising, after the transfer tool approaches the source carrier:
cooling the liquid receiving areas of at least the segments on which liquid drops have been arranged below a freezing point, wherein the liquid drops are at least partially frozen; and
after the transfer tool approaches the target carrier heating the liquid receiving areas of at least the segments on which liquid drops have been arranged above the freezing point, wherein the liquid drops are at least partially thawed.

### Claim 6 (depends on 1)

The method according to claim 1, further comprising, before lifting the transfer tool from the target carrier, removing the liquid drops.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the target carrier is provided with an attachment means disposed thereon, and the semiconductor chips disposed on the transfer tool contact the attachment means as the transfer tool approaches the target carrier.

### Claim 8 (depends on 1)

The method according to claim 1, wherein providing the semiconductor chips on the source carrier comprises:
providing a plurality of semiconductor chips in a regular array on a film;
providing the source carrier;
placing the film with the arrangement of semiconductor chips on the source carrier such that the semiconductor chips face the source carrier;
cooling the source carrier below the freezing point of water, wherein water condenses and freezes on the source carrier, and the semiconductor chips are fixed on the source carrier;
removing the film from the semiconductor chips, the semiconductor chips remaining on the source carrier; and
heating the source carrier, wherein water disposed on the source carrier melts and evaporates.

### Claim 9 (depends on 8)

The method according to claim 8, wherein said film comprises a carrier film and an adhesive film disposed on said carrier film, and said semiconductor chips are disposed on said adhesive film.

### Claim 10 (depends on 8)

The method according to claim 8, wherein the source carrier is provided with a structured upper side with chip receiving areas delimited from each other, and the film with the arrangement of semiconductor chips is disposed on the source carrier such that each semiconductor chip is arranged on its own chip receiving area.