US 11,114,404 B2Granted

Electronic device including electrical connections on an encapsulation block

AssigneesSTMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SAS

InventorsRomain Coffy, Patrick Laurent, Laurent Schwartz

Life of this patent

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Abstract

An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

Claims18

Dependent claims

An electronic device, comprising:

an integrated circuit chip having a front face provided with an electrical connection pad;
an overmolded encapsulation block for encapsulating the integrated circuit chip, the overmolded encapsulation block comprising a front layer at least partially covering the front face of the integrated circuit chip;
wherein the overmolded encapsulation block comprises a plastic material containing additive particles in the form of active metal grains;
wherein the overmolded encapsulation block includes a through-hole located above the electrical connection pad of the integrated circuit chip;
an inner metal layer covering a wall of the through-hole, wherein the inner metal layer is joined to the electrical connection pad of the integrated circuit chip and is attached or anchored to the active metal grains at the wall of the through-hole;
and
a local front metal layer on a local zone of the front face of the overmolded encapsulation block, said local zone extending adjacent to the through-hole, wherein the local front metal layer is joined to the inner metal layer and is attached or anchored to the active metal grains at the local zone;
wherein the local front metal layer forms an electrical connection.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/704,082Filed 5 Dec 2019
Priority: FR 187278912 Dec 2018
Published: US 2020/0194397 A118 Jun 2020
Granted: 7 Sep 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification33 codes

H10W 72/90
Interconnections or connectors in packages: bond pads, in general
H10W 74/127
The semiconductor body being completely enclosed: characterised by arrangements for sealing or adhesion
H10W 74/01
Encapsulations, e.g. protective coatings: manufacture or treatment
H10W 74/114
The semiconductor body being completely enclosed: by a substrate and the encapsulations