Signal routing carrier
AssigneeIntel Corporation
InventorsLijiang Wang, Jianyong Xie, Sujit Sharan, Robert L. Sankman
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Abstract
An electronic device and associated methods are disclosed. In one example, the electronic device includes an article having a substrate, a semiconductor die thereon, a routing carrier attached to the substrate, and a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier. In selected examples, the article is made by manufacturing a substrate, attaching a semiconductor die to the substrate, fabricating a routing carrier comprising a transmission pathway, and integrating the routing carrier into the substrate.
Claims10
An article comprising:
- a substrate;
- a semiconductor die thereon;
- a routing carrier attached to the substrate;
- and
- a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier,
- wherein the transmission pathway has a loss of no more than 2.5 dB at a signaling speed of about 50 Gbpa to about 250 Gbps.
Dependencies are inferred from the claim text.