Antenna package structure and antenna packaging method

An antenna packaging method, comprising steps of:

• 1) providing a support substrate, and forming a separation layer on the support substrate;
• 2) forming a rewiring layer on the separation layer, wherein the rewiring layer has a first surface connected to the separation layer and a second surface opposite to the first surface, wherein the rewiring layer comprises a first metal wiring layer and a first dielectric layer;
• 3) forming a metal connecting column on the first metal wiring layer of the rewiring layer;
• 4) disposing a packaging layer on the rewiring layer, and thinning the packaging layer, wherein the metal connecting column has a top portion protruding from the packaging layer so that the top portion of the metal connecting column is exposed from the packaging layer;
• and forming a second dielectric layer on a surface of the packaging layer, wherein a top surface of the metal connecting column is exposed from the second dielectric layer;
• 5) forming an antenna metal layer on a surface of the second dielectric layer, wherein the antenna metal layer is connected to the metal connecting column;
• 6) stripping off the separation layer to remove the support substrate, and to expose the first surface of the rewiring layer;
• 7) providing an antenna circuit chip, and bonding the antenna circuit chip to the first metal wiring layer of the rewiring layer, so that the antenna circuit chip is electrically connected to the antenna metal layer from the first metal wiring layer and the metal connecting column;
• and
• 8) forming a metal bump on the first metal wiring layer of the rewiring layer, to form electrical lead-out of the rewiring layer.