# US 11,114,385 B2 · Plate-shaped workpiece processing method

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- Number: US 11,114,385 B2
- Document ID: US11114385B2
- Status: Granted
- Kind: B2
- Application number: 16/365,045
- Filed: 2019-03-26
- Published: 2019-10-03
- Granted: 2021-09-07
- Earliest claimed: 2018-03-28
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Youngsuk Kim; Byeongdeck Jang
- Web page: https://patentgrep.com/patent/US11114385B2

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 74/014: {using batch processing}
- H10P 72/70: for supporting or gripping
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers}
- H10W 72/0198: {batch processes}
- H10W 74/016: {using moulds}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7418: {of passive members, e.g. a chip mounting substrate}
- H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A processing method for dividing a plate-shaped workpiece into a plurality of individual packages along a plurality of crossing division lines, in which the workpiece has terminals on the back side, includes the steps of attaching a protective member to the back side of the workpiece so as to cover the terminals to thereby unite the protective member with the workpiece, dividing the workpiece with the protective member along each division line to obtain the individual packages in a condition where the protective member is attached to each package, forming a conductive shield layer on the outer surface of each package, and peeling the protective member from each package.

## Claims

### Claim 1

A plate-shaped workpiece processing method for dividing a plate-shaped workpiece into a plurality of individual packages along a plurality of crossing division lines, the workpiece including a wiring member having a first surface and a second surface opposite to the first surface, the first surface of the wiring member being partitioned into a plurality of regions by the plurality of crossing division lines, a plurality of terminals formed on each region of the first surface of the wiring member, a plurality of semiconductor chips mounted on the second surface of the wiring member by bonding, and a sealing layer formed on the second surface of the wiring member so as to seal the plurality of semiconductor chips, the sealing layer being formed from a sealing compound, the plate-shaped workpiece processing method comprising:
a protective member attaching step of attaching a protective member to the first surface of the wiring member, the protective member having an adhesive layer for protecting the plurality of terminals and a base sheet attached to the adhesive layer;
a dividing step of dividing the plate-shaped workpiece and the protective member along each division line of the plurality of crossing division lines after performing the protective member attaching step, thereby obtaining the individual packages in a condition where the protective member is attached to each package of the plurality of individual packages, wherein the dividing step includes cutting through both the base sheet and the adhesive layer of the protective member;
a shield layer forming step of forming a conductive shield layer on an outer surface of each package of the plurality of individual packages after performing the dividing step; and
a protective member peeling step of peeling the protective member from each package of the plurality of individual packages after performing the shield layer forming step.

### Claim 2

A plate-shaped workpiece processing method for dividing a plate-shaped workpiece into a plurality of individual packages along a plurality of crossing division lines, the workpiece including a wiring member having a first surface and a second surface opposite to the first surface, the first surface of the wiring member being partitioned into a plurality of regions by the plurality of crossing division lines, a plurality of terminals formed on each region of the first surface of the wiring member, a plurality of semiconductor chips mounted on the second surface of the wiring member by bonding, and a sealing layer formed on the second surface of the wiring member so as to seal the plurality of semiconductor chips, the sealing layer being formed from a sealing compound, the plate-shaped workpiece processing method comprising:
a protective member attaching step of attaching a protective member to the first surface of the wiring member, the protective member having an adhesive layer for protecting the plurality of terminals;
a dividing step of dividing the plate-shaped workpiece and the protective member along each division line of the plurality of crossing division lines after performing the protective member attaching step, thereby obtaining the individual packages in a condition where the protective member is attached to each package of the plurality of individual packages;
a shield layer forming step of forming a conductive shield layer on an outer surface of each package of the plurality of individual packages after performing the dividing step;
a protective member peeling step of peeling the protective member from each package of the plurality of individual packages after performing the shield layer forming step; and
a workpiece holding step of holding the workpiece through the protective member on a holding jig after performing the protective member attaching step,
wherein the protective member is held under suction on the holding jig.

### Claim 3 (depends on 2)

The plate-shaped workpiece processing method according to claim 2, further comprising:
a V groove forming step of cutting the workpiece along each division line of the plurality of crossing division lines to the depth from an upper surface of the sealing layer to a middle of a thickness of the plate-shaped workpiece by using a V groove forming unit after performing the workpiece holding step, thereby forming a V groove in the plate-shaped workpiece along each division line of the plurality of crossing division lines, the V groove having a side wall inclined from the upper surface of the sealing layer to a bottom of the V groove.

### Claim 4 (depends on 1)

The plate-shaped workpiece processing method according to claim 1, further comprising:
a workpiece holding step of holding the plate-shaped workpiece through the protective member on a holding tape after performing the protective member attaching step,
wherein the protective member is attached to the holding tape.

### Claim 5 (depends on 4)

The plate-shaped workpiece processing method according to claim 4, further comprising:
a V groove forming step of cutting the plate-shaped workpiece along each division line of the plurality of crossing division lines to the depth from the upper surface of the sealing layer to the middle of the thickness of the plate-shaped workpiece by using a V groove forming unit after performing the workpiece holding step, thereby forming a V groove in the plate-shaped workpiece along each division line of the plurality of crossing division lines, the V groove having a side wall inclined from the upper surface of the sealing layer to the bottom of the V groove.