Semiconductor devices having integrated optical components
AssigneeMicron Technology, Inc.
InventorJohn F. Kaeding
Life of this patent
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Abstract
Semiconductor devices having optical routing layers, and associated systems and methods, are disclosed herein. In one embodiment, a method of manufacturing a semiconductor device includes forming conductive pads on a first side of a substrate and electrically coupled to conductive material of vias extending partially through the substrate. The method further includes removing material from a second side of the substrate so that the conductive material of the vias projects beyond the second side of the substrate to define projecting portions of the conductive material. The method also includes forming an optical routing layer on the second side of the substrate and at least partially around the projecting portions of the conductive material.
Claims22
A semiconductor device, comprising:
- a substrate having a front side, a plurality of circuit elements at the front side, and a back side opposite the front side;
- through-substrate vias (TSVs) extending from the front side of the substrate through the substrate;
- conductive material in the TSVs;
- conductive pillars on the front side of the substrate over and electrically coupled to the conductive material in corresponding ones of the TSVs, wherein the conductive pillars have a first height;
- an optical routing layer on the back side of the substrate, wherein the conductive material in at least a portion of the TSVs projects past the back side of the substrate and through the optical routing layer;
- and
- under bump metallization (UBM) features on the optical routing layer and electrically coupled to the conductive material in corresponding ones of the portion of the TSVs, wherein the UBM features have a second height less than the first height.
A semiconductor die package, comprising:
- a semiconductor die including—
- a substrate having a first surface and a second surface opposite the first surface;
- through-substrate vias (TSVs) in the substrate, the TSVs including a conductive material extending through the substrate;
- an optical routing layer on the second surface, wherein the conductive material of the TSVs projects from the second surface of the substrate and through the optical routing layer;
- conductive pillars on the first surface of the substrate over and electrically coupled to corresponding ones of the TSVs, wherein the conductive pillars have a first height;
- and
- under bump metallization (UBM) features on the optical routing layer and electrically coupled to corresponding ones of the TSVs, wherein the UBM features have a second height less than the first height;
- an active optical component (a) electrically coupled to the conductive material of at least one of the TSVs and (b) optically coupled to the optical routing layer;
- and
- an optical fiber optically coupled to the optical routing layer.
A semiconductor device, comprising:
- a substrate having a front side, a plurality of circuit elements at the front side, and a back side opposite the front side;
- through-substrate vias (TSVs) extending at least partially through the substrate;
- conductive material in the TSVs;
- an optical routing layer on the back side of the substrate and configured to optically couple with an active optical component exterior to the optical routing layer, wherein the conductive material in at least a portion of the TSVs projects past the back side of the substrate and into the optical routing layer;
- conductive pillars on the front side of the substrate over and electrically coupled to the conductive material in corresponding ones of the TSVs, wherein the conductive pillars have a first height;
- and
- under bump metallization (UBM) features on the optical routing layer and electrically coupled to the conductive material in corresponding ones of the portion of the TSVs, wherein the UBM features have a second height less than the first height.
The semiconductor device of 17, further comprising an optical fiber optically coupled to the optical routing layer.
Dependencies are inferred from the claim text.