# US 11,114,371 B2 · Substrate-on-substrate structure and electronic device comprising the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,371 B2 - Document ID: US11114371B2 - Status: Granted - Kind: B2 - Application number: 16/800,201 - Filed: 2020-02-25 - Published: 2021-06-17 - Granted: 2021-09-07 - Earliest claimed: 2019-12-11 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Yong Hoon Kim; Seung Eun Lee; Young Kwan Lee; Hak Chun Kim - Web page: https://patentgrep.com/patent/US11114371B2 ## CPC - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 70/635: {Through-vias} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 72/00: Interconnections or connectors in packages - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 2201/10977: Encapsulated connections - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A substrate-on-substrate structure and an electronic device including the same are provided. The substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure. ## Claims ### Claim 1 A substrate-on-substrate structure, comprising: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, the second printed circuit board having a first side connected to the second side of the first printed circuit board, and the second printed circuit board having a second side opposite to the first side of the second printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure, wherein the underfill resin is disposed in at least a portion between the second side of the first printed circuit board and the reinforcing structure. ### Claim 2 (depends on 1) The substrate-on-substrate structure of claim 1, further comprising: a plurality of electrical connection metals disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and connecting the second side of the first printed circuit board to the first side of the second printed circuit board, wherein the underfill resin covers at least a portion of each of the plurality of electrical connection metals. ### Claim 3 (depends on 2) The substrate-on-substrate structure of claim 2, further comprising: a passive component mounted on the first side of the second printed circuit board, wherein the underfill resin covers at least portion of the passive component. ### Claim 4 (depends on 3) The substrate-on-substrate structure of claim 3, wherein the reinforcing structure has a through portion, and the plurality of electrical connection metals and the passive component are disposed in the through portion. ### Claim 5 (depends on 1) The substrate-on-substrate structure of claim 1, wherein the reinforcing structure is continuously disposed along an edge of the first side of the second printed circuit board. ### Claim 6 (depends on 1) The substrate-on-substrate structure of claim 1, wherein the reinforcing structure is attached to the first side of the second printed circuit board through an adhesive. ### Claim 7 (depends on 1) The substrate-on-substrate structure of claim 1, wherein the first printed circuit board is a core type printed circuit board, and the second printed circuit board is a coreless type printed circuit board. ### Claim 8 (depends on 7) The substrate-on-substrate structure of claim 7, wherein the first printed circuit board is thicker than the second printed circuit board. ### Claim 9 (depends on 7) The substrate-on-substrate structure of claim 7, wherein a planar area of the first printed circuit board is greater than that of the second printed circuit board. ### Claim 10 (depends on 1) The substrate-on-substrate structure of claim 1, wherein the first printed circuit board includes first pads having a first pitch in the first side of the first printed circuit board, the second printed circuit board includes second pads having a second pitch in the first side of the second printed circuit board, and the first pitch is greater than the second pitch. ### Claim 11 (depends on 10) The substrate-on-substrate structure of claim 10, wherein the second printed circuit board further includes third pads having a third pitch in the second side of the second printed circuit board, and the second pitch is greater than the third pitch. ### Claim 12 An electronic device, comprising: a mainboard; a first printed circuit board disposed on an upper side of the mainboard; a second printed circuit board disposed on an upper side of the first printed circuit board; an electronic component disposed on an upper side of the second printed circuit board; a reinforcing structure disposed between the first and second printed circuit boards, attached to a lower side of the second printed circuit board, and spaced apart from the first printed circuit board; and an underfill resin disposed between the first and second printed circuit boards, and covering at least a portion of the reinforcing structure, wherein the underfill resin is disposed between the first printed circuit board and the reinforcing structure. ### Claim 13 (depends on 12) The electronic device of claim 12, wherein the first printed circuit board is mounted on the mainboard through a plurality of first electrical connection metals having a first pitch, the second printed circuit board is mounted on the first printed circuit board through a plurality of second electrical connection metals having a second pitch, the electronic component is mounted on the second printed circuit board through a plurality of third electrical connection metals having a third pitch, the first pitch is greater than the second pitch, and the second pitch is greater than the third pitch. ### Claim 14 A substrate-on-substrate structure, comprising: a mainboard; a first printed circuit board; first electrical connection metals disposed on a lower side of the first printed circuit board; a second printed circuit board disposed on an upper side of the first printed circuit board; second electrical connection metals disposed between the upper side of the first printed circuit board and a lower side of the second printed circuit board, and connecting the first printed circuit board and the second printed circuit board to each other; third electrical connection metals disposed on an upper side of the second printed circuit board; and a reinforcing structure disposed between the first and second printed circuit boards, attached to the lower side of the second printed circuit board, and spaced apart from the first printed circuit board, wherein the first printed circuit board is mounted on the mainboard through the first electrical connection metals. ### Claim 15 (depends on 14) The substrate-on-substrate structure of claim 14, further comprising: an underfill resin disposed between the first and second printed circuit boards, and covering at least a portion of the reinforcing structure. ### Claim 16 (depends on 14) The substrate-on-substrate structure of claim 14, wherein the reinforcing structure is composed of a metal or a ceramic. ### Claim 17 (depends on 14) The substrate-on-substrate structure of claim 14, wherein an elastic modulus of the reinforcing structure is greater than each of an elastic modulus of a build-up layer of the first printed circuit board and an elastic modulus of a build-up layer of the second printed circuit board. ### Claim 18 (depends on 14) The substrate-on-substrate structure of claim 14, wherein the reinforcing structure has a through hole, in which each of the second electrical connection metals is disposed.