Base material, mold package, base material manufacturing method, and mold package manufacturing method

A base material comprising:

• one surface;
• and
• a side surface continuous with the one surface, wherein
• each of the one surface and the side surface has a sealed region to be sealed with a mold resin,
• the one surface includes a one surface rough region that has a rough shape in the sealed region,
• the side surface includes a side surface rough region that has a rough shape in the sealed region,
• each of the one surface rough region and the side surface rough region is provided by a plurality of metal particles stacked on one another,
• the one surface has a connection region to be connected to a connection member in the sealed region,
• the one surface rough region includes a first rough region disposed in a region including the connection region, and a second rough region disposed in a region different from the first rough region,
• the first rough region is provided by the plurality of metal particles stacked on one another, and
• the second rough region is formed with a groove and is provided by the plurality of metal particles stacked in a region including the groove, and a height difference between protrusions and recesses of the second rough region is greater than that of the first rough region.

A mold package in which a mounting portion and a terminal portion are both sealed with a mold resin, the mold package comprising:

• the mounting portion having one surface, and a side surface continuous with the one surface;
• the terminal portion having one surface and a side surface continuous with the one surface;
• a semiconductor chip mounted on the one surface of the mounting portion;
• a connection member electrically connecting the semiconductor chip and the terminal portion;
• and
• the mold resin sealing the one surface and the side surface of the mounting portion, and the one surface and the side surface of the terminal portion while sealing the semiconductor chip and the connection member, wherein
• each of the mounting portion and the terminal portion includes a one surface rough region having a rough shape in a sealed region of the one surface sealed with the mold resin, and a side surface rough region having a rough shape in a sealed region of the side surface sealed with the mold resin,
• each of the one surface rough region and the side surface rough region is provided by a plurality of metal particles stacked on one another,
• the one surface includes a connection region to be connected to a connection member in the sealed region,
• the one surface rough region is provided in a region different from the connection region,
• the one surface rough region includes a first rough region disposed adjacent to the connection region, and a second rough region disposed on a side opposite to the connection region with respect to the first rough region,
• the first rough region is provided by the plurality of metal particles stacked on one another, and
• the second rough region is formed with a groove and is provided by the plurality of metal particles stacked in a region including the groove, and a height difference between protrusions and recesses of the second rough region is greater than that of the first rough region.

A mold package in which a mounting portion and a terminal portion are both sealed with mold resin, the mold package comprising:

• the mounting portion having one surface, and a side surface continuous with the one surface;
• the terminal portion having one surface and a side surface continuous with the one surface;
• a semiconductor chip mounted on the one surface of the mounting portion;
• a connection member electrically connecting the semiconductor chip and the terminal portion;
• and
• the mold resin sealing the one surface and the side surface of the mounting portion, and the one surface and the side surface of the terminal portion while sealing the semiconductor chip and the connection member, wherein
• each of the mounting portion and the terminal portion includes a one surface rough region having a rough shape in a sealed region of the one surface sealed with the mold resin, and a side surface rough region having a rough shape in a sealed region of the side surface sealed with the mold resin,
• each of the one surface rough region and the side surface rough region is provided by a plurality of metal particles stacked on one another,
• the one surface has a connection region to be connected to a connection member in the sealed region,
• the one surface rough region includes a first rough region disposed in a region including the connection region, and a second rough region disposed in a region different from the first rough region,
• the first rough region is provided by the plurality of metal particles stacked on one another, and
• the second rough region is formed with a groove and is provided by the plurality of metal particles stacked in a region including the groove, and a height difference between protrusions and recesses of the second rough region is greater than that of the first rough region.

A method for manufacturing a base material that has one surface, and a side surface continuous with the one surface, and in which each of the one surface and the side surface has a sealed region to be sealed with a mold resin, the method comprising:

• preparing a base member that includes the one surface and the side surface, and is made of a metal material;
• forming a one surface rough region having a rough shape in the sealed region of the one surface;
• and
• forming a side surface rough region having a rough shape in the sealed region of the side surface, wherein
• in the forming of the one surface rough region and in the forming of the side surface rough region, metal particles are floated by forming a groove in the one surface, and the floated metal particles are deposited and stacked on the groove and a periphery of the groove on the one surface, and also deposited and stacked on the side surface, to thereby form the one surface rough region and the side surface rough region.

A method for manufacturing a base material that has one surface, and a side surface continuous with the one surface, and in which each of the one surface and the side surface has a sealed region to be sealed with a mold resin, the method comprising:

• preparing a base member that has the one surface and the side surface;
• forming a one surface rough region that has a rough shape in the sealed region of the one surface;
• and
• forming a side surface rough region that has a rough shape in the sealed region of the side surface, wherein
• in the forming of the one surface rough region and the forming of the side surface rough region, a target member made of a metal material is prepared, and the one surface rough region and the side surface rough region are formed by floating metal particles from the target member, and depositing and stacking the floated metal particles on the one surface and the side surface.