Molded integrated circuit packages and methods of forming the same

An IC package, comprising:

• a first leadframe, comprising:
• a first die pad, and
• a plurality of first leads;
• a first die comprising a plurality of first bond pads, wherein the first die is attached to the first die pad of the first leadframe;
• a plurality of first bond wires, each attached to one of the first bond pads of the first die and to one of the first leads of the first leadframe;
• a first molded package body formed from a molding compound molded over each of:
• a portion of the first die pad of the first leadframe,
• a portion of the first leads of the first leadframe,
• a first portion of the first die, and
• one or more of the first bond wires,
• wherein the first molded package body partially defines a first cavity, and wherein a second portion of the first die contacts neither of the first die pad and the first molded package body;
• a second die comprising a plurality of second bond pads, wherein the second die is attached to the second portion of the first die in the first cavity;
• and
• a plurality of second bond wires, each attached to one of the first bond pads of the first die and to one of the second bond pads of the second die;
• and
• a second leadframe, comprising:
• a second die pad, and
• a plurality of second leads;
• a third die, comprising a plurality of third bond pads, wherein the third die is attached to the second die pad of the second leadframe;
• a plurality of third bond wires, each attached to one of the third bond pads of the third die and to one of the second leads of the second leadframe;
• a second molded package body formed from the molding compound molded over each of:
• a portion of the second die pad of the second leadframe,
• a portion of the second leads of the second leadframe,
• a first portion of the third die, and
• one or more of the third bond wires,
• wherein the second molded package body partially defines a second cavity for the third die, and wherein a second portion of the third die contacts neither of the second die pad and the second molded package body;
• a fourth die, comprising a plurality of fourth bond pads, wherein the fourth die is attached to the second portion of the third die;
• and
• a plurality of fourth bond wires, each attached to one of the third bond pads of the third die and to one of the fourth bond pads of the fourth die.