# US 11,114,365 B2 · Electronic element mounting substrate, electronic device, and electronic module

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- Number: US 11,114,365 B2
- Document ID: US11114365B2
- Status: Granted
- Kind: B2
- Application number: 16/470,606
- Filed: 2017-12-21
- Published: 2019-10-10
- Granted: 2021-09-07
- Earliest claimed: 2016-12-22
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Noboru Kitazumi
- Web page: https://patentgrep.com/patent/US11114365B2

## CPC

- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 40/259: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H01S 5/0206: {Substrates, e.g. growth, shape, material, removal or bonding; (specific crystal orientation H01S5/3202)}
- H01S 5/02218: Material of the housings; Filling of the housings
- H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
- H05K 1/02: Details
- H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H10H 20/85: Packages
- H10W 40/10: Arrangements for heating
- H10W 40/25: characterised by their materials
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/692: Ceramics or glasses
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H01S 5/0237: by soldering
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An electronic element mounting substrate includes a first substrate including a first main surface and a mounting portion in a rectangular shape for mounting an electronic element, positioned on the first main surface and one end portion of the mounting portion in a longitudinal direction being positioned at an outer edge portion of the first main surface and a second substrate positioned on a second main surface opposite to the first main surface, formed of a carbon material, and including a third main surface facing the second main surface and a fourth main surface opposite to the third main surface. A thermal conduction of the mounting portion in a direction perpendicular to in a longitudinal direction is greater than a thermal conduction of the mounting portion in the longitudinal direction, in the third main surface or the fourth main surface, in plan view.

## Claims

### Claim 1

An electronic element mounting substrate, the substrate comprising:
a first substrate comprising a first main surface and a second main surface opposite to the first main surface; and
a plurality of second substrates each comprising a third main surface and a fourth main surface opposite to the third main surface,
the first substrate comprising a mounting portion for mounting an electronic element, positioned on the first main surface,
the mounting portion having a rectangular shape,
one end portion of the mounting portion in a longitudinal direction being positioned at an outer edge portion of the first main surface,
the plurality of second substrates being formed of a carbon material,
the third main face of the second substrate which is positioned closest to the first substrate facing the second main surface,
the plurality of second substrates are stacked in a thickness direction of the first substrate, wherein
a thermal conduction of the mounting portion in a direction perpendicular to the longitudinal direction is greater than a thermal conduction of the mounting portion in the longitudinal direction, in the third main surface of the second substrate which is positioned closest to the first substrate, in plan view,
two adjacent second substrates of the plurality of second substrates are so configured that a direction in which a thermal conductivity of one of the two adjacent second substrates increases and a direction in which a thermal conductivity of the other of the two adjacent second substrates increases are perpendicular to each other in plan view, and
each of the plurality of second substrates comprises a first side surface on a side where the one end portion is located in plan view, and is so configured that a thermal conduction in the first side surface in a thickness direction is greater than a thermal conduction in a direction perpendicular to the thickness direction.

### Claim 2 (depends on 1)

The electronic element mounting substrate according to claim 1, wherein
each of the plurality of second substrates comprises a second side surface opposite to the first side surface, and is so configured that a thermal conduction in the second side surface in the thickness direction is greater than a thermal conduction in the direction perpendicular to the thickness direction.

### Claim 3 (depends on 2)

An electronic device, comprising:
the electronic element mounting substrate according to claim 2;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a wiring board or an electronic element housing package on which the electronic element mounting substrate is mounted.

### Claim 4 (depends on 3)

An electronic module, comprising:
the electronic device according to claim 3; and
a module substrate connected with the electronic device.

### Claim 5

An electronic device, comprising:
an electronic element mounting substrate including
a first substrate comprising a first main surface and a second main surface opposite to the first main surface; and
a plurality of second substrates each comprising a third main surface and a fourth main surface opposite to the third main surface,
the first substrate comprising a mounting portion for mounting an electronic element, positioned on the first main surface,
the mounting portion having a rectangular shape,
one end portion of the mounting portion in a longitudinal direction being positioned at an outer edge portion of the first main surface,
the plurality of second substrates being formed of a carbon material,
the third main face of the second substrate which is positioned closest to the first substrate facing the second main surface,
the plurality of second substrates are stacked in a thickness direction of the first substrate, wherein
a thermal conduction of the mounting portion in a direction perpendicular to the longitudinal direction is greater than a thermal conduction of the mounting portion in the longitudinal direction, in the third main surface of the second substrate which is positioned closest to the first substrate, in plan view,
two adjacent second substrates of the plurality of second substrates are so configured that a direction in which a thermal conductivity of one of the two adjacent second substrates increases and a direction in which a thermal conductivity of the other of the two adjacent second substrates increases are perpendicular to each other in plan view, and
each of the plurality of second substrates comprises a first side surface on a side where the one end portion is located in plan view, and is so configured that a thermal conduction in the first side surface in a thickness direction is greater than a thermal conduction in a direction perpendicular to the thickness direction;
an electronic element mounted on the mounting portion of the electronic element mounting substrate; and
a wiring board or an electronic element housing package on which the electronic element mounting substrate is mounted.

### Claim 6 (depends on 5)

An electronic module, comprising:
the electronic device according to claim 5; and
a module substrate connected with the electronic device.