Electronic package arrangements and related methods

A method comprising:

• providing a substrate comprising a first face and a second face that opposes the first face;
• mounting a first electronic device on the first face of the substrate;
• forming an overmold body around peripheral edges of the first electronic device, the overmold body forming a recess that extends through the overmold body to the first face of the substrate;
• forming a heat spreader from a lead frame structure;
• and
• placing the heat spreader over the first electronic device and within the recess such that the heat spreader is thermally coupled to the first electronic device and the first face of the substrate.

An electronic package comprising:

• a substrate forming a first face and a second face that opposes the first face;
• a first electronic device mounted on the first face of the substrate;
• an overmold body on the first face of the substrate, the overmold body forming a first recess that extends through the overmold body to the first face of the substrate;
• a metal frame structure arranged over the overmold body and within the first recess such that the metal frame structure forms an electromagnetic shield for the first electronic device;
• and
• a bottom heat sink on the second face of the substrate, wherein a heat dissipation path is formed between the metal frame structure and the bottom heat sink that extends through the first recess and the substrate.