Back to results
US 11,114,362 B2Granted
Stacked semiconductor package having heat dissipation structure
AssigneeSK hynix Inc.
InventorsBok Kyu Choi, Jong Hoon Kim, Ki Bum Kim
Life of this patent
Estimating the term…
Abstract
A stacked semiconductor package includes a first die, a second die stacked on a surface of the first die, a heat dissipation layer disposed on the surface, a heat insulation layer disposed on the surface to cover the heat dissipation layer and the first die, a heat sink disposed on the second die, and a heat conduction structure spaced apart from the second die in a lateral direction on the surface to connect the heat dissipation layer to the heat sink.
Claims20
A stacked semiconductor package comprising:
- a first die;
- a second die stacked on a surface of the first die;
- a heat dissipation layer disposed on the surface;
- a heat insulation layer disposed on the surface to cover the heat dissipation layer and the first die;
- a heat sink disposed on the second die;
- and
- a heat conduction structure spaced apart from the second die in a lateral direction on the surface to connect the heat dissipation layer to the heat sink,
- wherein the heat insulation layer covers at least a portion of an upper surface of the heat dissipation layer, and
- wherein the stacked semiconductor package further comprises a mold layer burying the second die and the heat conduction structure between the first die and the heat sink.
6 more elements
A stacked semiconductor package comprising:
- a first die;
- a heat dissipation layer disposed on a surface of the first die to cover at least a portion of the first die;
- a second die stacked on the surface and connected to the first die by a connection structure;
- a heat insulation layer disposed on the surface to cover the connection structure, the heat dissipation layer, and the first die;
- a heat sink disposed on the second die;
- and
- a heat conduction structure spaced apart from the second die in a lateral direction on the surface to connect the heat dissipation layer to the heat sink,
- wherein the heat insulation layer covers at least a portion of an upper surface of the heat dissipation layer, and
- wherein the stacked semiconductor package further comprises a mold layer burying the second die and the heat conduction structure between the first die and the heat sink.
6 more elements
Dependencies are inferred from the claim text.