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US 11,114,361 B2Granted
Electronics assemblies and methods of manufacturing electronics assemblies with improved thermal performance
AssigneeIntelligent Platforms, LLC
InventorBernd Sporer
Life of this patent
Estimating the term…
Abstract
Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.
Claims15
An electronics assembly, comprising:
- a printed circuit board (PCB) comprising two or more cutouts;
- an electronic device;
- and
- a heat spreader arranged to dissipate heat generated by the electronic device and comprising a base surface and two or more legs extending outwardly from the base surface, each of the legs having an end portion soldered in a respective cutout of the two or more cutouts,
- wherein the PCB further comprises two or more solder pads disposed in the two or more cutouts, respectively, and wherein the end portions are soldered to a respective solder pad.
2 more elements
An electronics assembly, comprising:
- a printed circuit board (PCB);
- an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component;
- a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component;
- and
- a first magnet adapted to be coupled to the integrated circuit package or the heat spreader to align the heat spreader relative to the integrated circuit package.
2 more elements
Dependencies are inferred from the claim text.