Multi-die device structures and methods
AssigneeXilinx, Inc.
InventorsJaspreet Singh Gandhi, Myongseob Kim
Life of this patent
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Abstract
Examples described herein provide techniques for multi-die device structures having improved gap uniformity between neighboring dies. In some examples, a first die and a second die are attached to an interposer. A first gap is defined by and between the first die and the second die. At least one of the first die or the second die is etched at the first gap. The etching defines a second gap defined by and between the first die and the second die. The first die, the second die, and the interposer are encapsulated with an encapsulant. The encapsulant is disposed in the second gap.
Claims20
A method for forming a mufti-die structure, the method comprising:
- attaching a first die and a second die to an interposer, a first gap being defined by and between the first die and the second die;
- etching at least one of the first die or the second die at the first gap, the etching defining a second gap defined by and between the first die and the second die;
- and
- encapsulating the first die, the second die, and the interposer with an encapsulant, the encapsulant being disposed in the second gap.
A method for forming a multi-die structure, the method comprising:
- attaching a first die to a first die-attach area of an interposer;
- attaching a second die to a second die-attach area of the interposer;
- and
- after attaching each of the first die and the second die to the interposer, defining a gap between the first die and the second die comprising anisotropically etching at least one of the first die or the second die.
A method for forming a multi-die structure, the method comprising:
- attaching a first die to a side of an interposer;
- attaching a second die to the side of the interposer;
- after attaching each of the first die and the second die to the interposer, defining a uniform gap between the first die and the second die comprising etching at least one of the first die or the second die, the first die having a first sidewall, the second die having a second sidewall, the first sidewall and the second sidewall defining the uniform gap;
- and
- encapsulating the first die, the second die, and the interposer with an encapsulant, the encapsulant being disposed in the uniform gap and adhered to the first sidewall and the second sidewall.
Dependencies are inferred from the claim text.