Back to results
US 11,114,353 B2Granted
Hybrid microelectronic substrates
AssigneeIntel Corporation
InventorsRobert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
Life of this patent
Estimating the term…
Abstract
Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.
Claims20
A hybrid microelectronic substrate, comprising:
- a low-density microelectronic substrate (LDMS) having a recess at a first surface, wherein the LDMS includes a first conductive pathway that extends to a bottom surface of the recess, and the LDMS is a printed circuit board (PCB);
- and
- a high-density microelectronic substrate (HDMS) at least partially in the recess and coupled to the bottom surface of the recess via solder interconnects, wherein the HDMS has a first surface and an opposing second surface, the first surface of the HDMS is between the second surface of the HDMS and the bottom surface of the recess, the HDMS has a first conductive contact at the first surface of the HDMS, the first conductive contact is coupled to the first conductive pathway via a solder interconnect, the HDMS includes a second conductive pathway that extends between the second surface of the HDMS and the first conductive contact, the HDMS has a second conductive contact at the second surface of the HDMS, the HDMS does not include a semiconductor layer, the HDMS includes a stack of layers of dielectric material, and the stack extends from the first surface of the HDMS to the second surface of the HDMS.
A hybrid microelectronic substrate, comprising:
- a low-density microelectronic substrate (LDMS) having a recess at a first surface, wherein the LDMS includes a first conductive pathway that extends to a bottom surface of the recess;
- and
- a high-density microelectronic substrate (HDMS) in the recess and coupled to the bottom surface of the recess via solder interconnects, wherein the HDMS has a first surface and an opposing second surface, the first surface of the HDMS is between the second surface of the HDMS and the bottom surface of the recess, the HDMS has a first conductive contact at the first surface of the HDMS, the first conductive contact is coupled to the first conductive pathway via a solder interconnect, the HDMS includes a second conductive pathway, the HDMS has a second conductive contact at the second surface of the HDMS, the second conductive contact is coupled to the second conductive pathway, the HDMS includes a stack of layers of dielectric material, and the stack extends from the first surface of the HDMS to the second surface of the HDMS.
Dependencies are inferred from the claim text.